Development of MWCNT-based strain sensor using flexible substrate

Kanji Yumoto, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Highly sensitive two-dimensional strain sensor, which consists of area-arrayed fine bundles of multi-walled carbon nanotubes (MWCNTs), has been developed by applying MEMS technology. Area-arrayed MWCNT bundles were grown on a substrate by CVD technique. When a compressive load was applied to the bundle, the electrical resistance of the bundle increased monotonically due to the change of the electronic band structure of the deformed CNT. By measuring the change of the resistance of each bundle, the two-dimensional distribution of the applied pressure was detected precisely. In the previous study, it was found that MWCNT bundle deformed repeatedly in the strain range up to 60%. Thus, in this study, the deformation behaviour of the MWCNT bundle on a flexible substrate, which is effective for rough surface, was observed. It was confirmed that the MWCNT bundle coated by PDMS showed elastic deformation under the application of axial compressive load of 60%, and the allowable maximum load was 3 mN.

Original languageEnglish
Title of host publication2016 IEEE 37th International Electronics Manufacturing Technology, IEMT 2016 and 18th Electronics Materials and Packaging Conference, EMAP 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509034437
DOIs
Publication statusPublished - 2016 Nov 28
Event37th IEEE International Electronics Manufacturing Technology, IEMT 2016 and 18th Electronics Materials and Packaging Conference, EMAP 2016 - Georgetown, Penang, Malaysia
Duration: 2016 Sep 202016 Sep 22

Publication series

NameProceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
Volume2016-November
ISSN (Print)1089-8190

Other

Other37th IEEE International Electronics Manufacturing Technology, IEMT 2016 and 18th Electronics Materials and Packaging Conference, EMAP 2016
CountryMalaysia
CityGeorgetown, Penang
Period16/9/2016/9/22

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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