Development of Micro Ultrasonic Abrasive Machining System (1st Report, Studies in Micro Ultrasonic Abrasive Machining)

Tsunemoto Kuriyagawa, Tatsuya Shirosawa, Osamu Saitoh, Katsuo Syoji

Research output: Contribution to journalArticlepeer-review

13 Citations (Scopus)

Abstract

This paper deals with the development of a micro ultrasonic abrasive machining system. The size of every component for opto-electrical devices or micro electromechanical systems (MEMS) has been reduced in recent years due to progress in opto-digital communications technology. The demands for micro-sized holes, slits and 3D structures of hard brittle materials such as ceramics and glass are considerable. In this study, a micro ultrasonic abrasive machining system was developed, which has an aerostatic ultrasonic vibration spindle, 3-axis NC sliding tables, dynamometer for machining pressure control and on-machine shaping system for small-diameter tools. The tools (0.03-1.0 mm in diameter) and ultra-fine SiC slurry are used in the micro ultrasonic machining, and basic characteristics in micro-hole machining of glass are investigated. As the tool diameter becomes smaller, the machining speed and tool wear become the worse. However, rotating the tool doubled the machining speed, and decreased a protrusion left in the center of the machined hole due to cavitation.

Original languageEnglish
Pages (from-to)593-600
Number of pages8
JournalJSME International Journal. Series C: Mechanical Systems, Machine Elements and Manufacturing
Volume45
Issue number2
DOIs
Publication statusPublished - 2002

Keywords

  • Abrasive Grain
  • Cavitation
  • Machinability
  • Micro Mechanical Fabrication
  • Micro Tool
  • Non-Traditional Machining
  • Slurry
  • Sub-Milli-Structure
  • Ultrasonic Machining

ASJC Scopus subject areas

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

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