Development of materials design tool and its application in Pb-free micro-solders in electronic package

Xingjun Liu, Cuiping Wang, Ikuo Ohnuma, Shuanglin Chen, Ryosuke Kainuma, Kiyohito Ishida, Austin Y. Chang

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

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Chemical Compounds

Engineering & Materials Science