Development of materials design tool and its application in Pb-free micro-solders in electronic package

Xingjun Liu, Cuiping Wang, Ikuo Ohnuma, Shuanglin Chen, Ryosuke Kainuma, Kiyohito Ishida, Austin Y. Chang

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)


A materials design tool for developing Pb-free soldering alloys in electronic package was developed based on comprehensive experimental data of phase equilibria and thermodynamic properties data accumulated with the CALPHAD (calculation of phase diagrams) method and contains 10 elements, namely, Ag, Au, Bi, Cu, In, Ni, Sb, Sn, Zn and Pb. It can handle the calculation of phase diagrams in all combinations of these elements and all composition ranges. In addition, based on this tool, the liquidus, solidus, phase fractions and constitutions, equilibrium and non-equilibrium solidification behavior, surface tension and viscosity of liquid, diffusion reactions and microstructural evolution, etc. can be predicted. Typical examples of the calculation and application of this tool are presented. The design tool is expected to be a powerful tool for the development of Pb-free solders, as well as for promoting the understanding of the interfacial phenomena between Cu substrate and Pb-free solders in electronic packaging technology.

Original languageEnglish
Pages (from-to)1495-1500
Number of pages6
JournalScience China Technological Sciences
Issue number6
Publication statusPublished - 2010 Jun


  • Calculation of phase diagram
  • Interfacial reaction
  • Pb-free solders
  • Phase field method
  • Thermodynamic database

ASJC Scopus subject areas

  • Materials Science(all)
  • Engineering(all)


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