TY - JOUR
T1 - Development of materials design tool and its application in Pb-free micro-solders in electronic package
AU - Liu, Xingjun
AU - Wang, Cuiping
AU - Ohnuma, Ikuo
AU - Chen, Shuanglin
AU - Kainuma, Ryosuke
AU - Ishida, Kiyohito
AU - Chang, Austin Y.
N1 - Funding Information:
This work was supported by the National Natural Science Foundation of China (Grant No. 50425101), the Ministry of Science and Technology, P. R. China (Grant No. 2009DFA52170), the National High-Tech Research and Development Program of China (“863” Project) (Grant No. 2009AA03Z101) and the Ministry of Education, P. R. China (Grant No. 707037).
PY - 2010/6
Y1 - 2010/6
N2 - A materials design tool for developing Pb-free soldering alloys in electronic package was developed based on comprehensive experimental data of phase equilibria and thermodynamic properties data accumulated with the CALPHAD (calculation of phase diagrams) method and contains 10 elements, namely, Ag, Au, Bi, Cu, In, Ni, Sb, Sn, Zn and Pb. It can handle the calculation of phase diagrams in all combinations of these elements and all composition ranges. In addition, based on this tool, the liquidus, solidus, phase fractions and constitutions, equilibrium and non-equilibrium solidification behavior, surface tension and viscosity of liquid, diffusion reactions and microstructural evolution, etc. can be predicted. Typical examples of the calculation and application of this tool are presented. The design tool is expected to be a powerful tool for the development of Pb-free solders, as well as for promoting the understanding of the interfacial phenomena between Cu substrate and Pb-free solders in electronic packaging technology.
AB - A materials design tool for developing Pb-free soldering alloys in electronic package was developed based on comprehensive experimental data of phase equilibria and thermodynamic properties data accumulated with the CALPHAD (calculation of phase diagrams) method and contains 10 elements, namely, Ag, Au, Bi, Cu, In, Ni, Sb, Sn, Zn and Pb. It can handle the calculation of phase diagrams in all combinations of these elements and all composition ranges. In addition, based on this tool, the liquidus, solidus, phase fractions and constitutions, equilibrium and non-equilibrium solidification behavior, surface tension and viscosity of liquid, diffusion reactions and microstructural evolution, etc. can be predicted. Typical examples of the calculation and application of this tool are presented. The design tool is expected to be a powerful tool for the development of Pb-free solders, as well as for promoting the understanding of the interfacial phenomena between Cu substrate and Pb-free solders in electronic packaging technology.
KW - Calculation of phase diagram
KW - Interfacial reaction
KW - Pb-free solders
KW - Phase field method
KW - Thermodynamic database
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U2 - 10.1007/s11431-010-3199-x
DO - 10.1007/s11431-010-3199-x
M3 - Article
AN - SCOPUS:77954098820
VL - 53
SP - 1495
EP - 1500
JO - Science China Technological Sciences
JF - Science China Technological Sciences
SN - 1674-7321
IS - 6
ER -