Development of highly-reliable microbump bonding technology using self-assembly of NCF-covered KGDs and multi-layer 3D stacking challenges

Yuka Ito, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Kanuku Ri, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)

Abstract

We have proposed a new multichip-to-wafer 3D stacking method with high throughput and high yield based on a capillary self-assembly method using liquid droplets. In this paper, we optimized conditions in self-assembly and microbump bonding using non-conductive film (NCF)-covered known good dies (KGDs). Self-assembly of the NCF-covered KGDs provided high chip alignment accuracy within approximately 1 μm. After the self-assembly and a subsequent thermal compression, resultant microbump chains composed of over 7,000 microbump joints exhibited good electrical properties of 32 mω/joint without bridge short and open failures. The microbump joint resistance varied within 5% of the initial values after thermal cycle test (TCT) of 1,000 cycles. In addition, we demonstrated a multi-layer 3D stacking by the self-assembly method with the NCF-covered KGDs.

Original languageEnglish
Title of host publication2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages336-341
Number of pages6
ISBN (Electronic)9781479986095
DOIs
Publication statusPublished - 2015 Jul 15
Event2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States
Duration: 2015 May 262015 May 29

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2015-July
ISSN (Print)0569-5503

Other

Other2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
CountryUnited States
CitySan Diego
Period15/5/2615/5/29

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Ito, Y., Murugesan, M., Kino, H., Fukushima, T., Ri, K., Choki, K., Tanaka, T., & Koyanagi, M. (2015). Development of highly-reliable microbump bonding technology using self-assembly of NCF-covered KGDs and multi-layer 3D stacking challenges. In 2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015 (pp. 336-341). [7159614] (Proceedings - Electronic Components and Technology Conference; Vol. 2015-July). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2015.7159614