Development of grain structure during friction-stir welding of Cu-30Zn brass

S. Mironov, K. Inagaki, Y. S. Sato, Hiroyuki Kokawa

Research output: Contribution to journalArticlepeer-review

41 Citations (Scopus)


High-resolution electron backscatter diffraction was employed to study the evolution of microstructure during friction stir welding of a typical low stacking fault energy material (Cu-30Zn brass) over a wide range of welding temperatures. In all cases, microstructure evolution was found to be governed by discontinuous recrystallization that occurred via grain-boundary bulging and subsequent recrystallization nucleation. This promoted drastic grain refinement and significant strengthening. The crystallographic textures that evolved were typically dominated by a simple shear texture.

Original languageEnglish
Pages (from-to)3137-3148
Number of pages12
JournalPhilosophical Magazine
Issue number27
Publication statusPublished - 2014 Sep 22


  • copper alloys
  • electron-backscatter diffraction (EBSD)
  • friction stir welding
  • microstructure
  • texture

ASJC Scopus subject areas

  • Condensed Matter Physics


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