Development of glyoxylic acid based electroless copper deposition on ruthenium

Fumihiro Inoue, Harold Philipsen, Marleen H. Van Der Veen, Stefaan Van Huylenbroeck, Silvia Armini, Herbert Struyf, Shoso Shingubara, Tetsu Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Glyoxylic acid is seen as a promising candidate to replace formaldehyde as reducing agent in electroless Cu baths. For deposition on ruthenium, the anodic reaction of glyoxylic acid has been evaluated and compared to formaldehyde using linear sweep voltammetry. Significant differences were observed for the deposition of copper on ruthenium. First of all, a faster nucleation to shorten the total process time, was inferred from open-circuit potential measurements. Secondary, we found 2,2' bipyridyl worked as stabilizer, brightener, and suppressor in this glyoxylic acid-based electroless bath. Thirdly, the purity of the copper films improved when 2,2' bipyridyl was present in the solution. Using the optimized composition for the electroless bath, we demonstrate a conformal Cu seed layer deposition (~100 nm) inside high aspect ratio (16.7) through Si vias. This work shows the potential for electroless Cu seeding for a through Si via metallization.

Original languageEnglish
Title of host publicationProcessing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6
EditorsD. P. Barkey, W. P. Dow, K. Kondo, M. Koyanagi, S. Shingubara, F. Roozeboom, P. Ramm, R. Akolkar, M. Hayase, S. Mathad
PublisherElectrochemical Society Inc.
Pages41-55
Number of pages15
Edition40
ISBN (Electronic)9781607685395
DOIs
Publication statusPublished - 2015 Jan 1
EventSymposium on Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6 - 2014 ECS and SMEQ Joint International Meeting - Cancun, Mexico
Duration: 2014 Oct 52014 Oct 9

Publication series

NameECS Transactions
Number40
Volume64
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Other

OtherSymposium on Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6 - 2014 ECS and SMEQ Joint International Meeting
CountryMexico
CityCancun
Period14/10/514/10/9

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'Development of glyoxylic acid based electroless copper deposition on ruthenium'. Together they form a unique fingerprint.

  • Cite this

    Inoue, F., Philipsen, H., Van Der Veen, M. H., Van Huylenbroeck, S., Armini, S., Struyf, H., Shingubara, S., & Tanaka, T. (2015). Development of glyoxylic acid based electroless copper deposition on ruthenium. In D. P. Barkey, W. P. Dow, K. Kondo, M. Koyanagi, S. Shingubara, F. Roozeboom, P. Ramm, R. Akolkar, M. Hayase, & S. Mathad (Eds.), Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6 (40 ed., pp. 41-55). (ECS Transactions; Vol. 64, No. 40). Electrochemical Society Inc.. https://doi.org/10.1149/06440.0041ecst