Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction

Yoshikazu Takaku, Ikuo Ohnuma, Ryosuke Kainuma, Yasushi Yamada, Yuji Yagi, Yuji Nishibe, Kiyohito Ishida

Research output: Contribution to journalArticle

39 Citations (Scopus)

Abstract

Bismuth and its alloys are candidates for Pb-free high-temperature solders that can be substituted for conventional Pb-rich Pb-Sn solders (melting point (mp) = 573-583 K). However, inferior properties such as brittleness and weak bonding strength should be improved for practical use. To that end, BiCu-X (X = Sb, Sn, and Zn) Pb-free high-temperature solders are proposed. Miscibility gaps in liquid BiCu-X alloys were surveyed using the thermodynamic database ADAMIS (alloy database for micro-solders), and compositions of the BiCu-X solders were designed on the basis of calculation. In-situ composite solders that consist of a Bi-base matrix with fine intermetallic compound (IMC) particles were produced by gas-atomizing and melt-spinning methods. The interfacial reaction between in-situ composite solders and Cu or Ni substrates was investigated. The IMCs at the interface formed a thin, uniform layer, which is an appropriate morphology for a reliable solder joint.

Original languageEnglish
Pages (from-to)1926-1932
Number of pages7
JournalJournal of Electronic Materials
Volume35
Issue number11
DOIs
Publication statusPublished - 2006 Nov 1

Keywords

  • ADAMIS (alloy database for micro-solders)
  • CALPHAD
  • Fine dispersed particles
  • High-temperature solder
  • Pb-free solder
  • Phase diagram

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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