TY - JOUR
T1 - Development of an LSI for tactile sensor systems on the whole-body of robots
AU - Muroyama, Masanori
AU - Makihata, Mitsutoshi
AU - Nakano, Yoshihiro
AU - Matsuzaki, Sakae
AU - Yamada, Hitoshi
AU - Yamaguchi, Ui
AU - Nakayama, Takahiro
AU - Nonomura, Yutaka
AU - Fujiyoshi, Motohiro
AU - Tanaka, Shuji
AU - Esashi, Masayoshi
PY - 2011/11/1
Y1 - 2011/11/1
N2 - We have developed a network type tactile sensor system, which realizes high-density tactile sensors on the whole-body of nursing and communication robots. The system consists of three kinds of nodes: host, relay and sensor nodes. Roles of the sensor node are to sense forces and, to encode the sensing data and to transmit the encoded data on serial channels by interruption handling. Relay nodes and host deal with a number of the encoded sensing data from the sensor nodes. A sensor node consists of a capacitive MEMS force sensor and a signal processing/transmission LSI. In this paper, details of an LSI for the sensor node are described. We designed experimental sensor node LSI chips by a commercial 0.18μm standard CMOS process. The 0.18μm LSIs were supplied in wafer level for MEMS post-process. The LSI chip area is 2.4mm × 2.4mm, which includes logic, CF converter and memory circuits. The maximum clock frequency of the chip with a large capacitive load is 10MHz. Measured power consumption at 10MHz clock is 2.23mW. Experimental results indicate that size, response time, sensor sensitivity and power consumption are all enough for practical tactile sensor systems.
AB - We have developed a network type tactile sensor system, which realizes high-density tactile sensors on the whole-body of nursing and communication robots. The system consists of three kinds of nodes: host, relay and sensor nodes. Roles of the sensor node are to sense forces and, to encode the sensing data and to transmit the encoded data on serial channels by interruption handling. Relay nodes and host deal with a number of the encoded sensing data from the sensor nodes. A sensor node consists of a capacitive MEMS force sensor and a signal processing/transmission LSI. In this paper, details of an LSI for the sensor node are described. We designed experimental sensor node LSI chips by a commercial 0.18μm standard CMOS process. The 0.18μm LSIs were supplied in wafer level for MEMS post-process. The LSI chip area is 2.4mm × 2.4mm, which includes logic, CF converter and memory circuits. The maximum clock frequency of the chip with a large capacitive load is 10MHz. Measured power consumption at 10MHz clock is 2.23mW. Experimental results indicate that size, response time, sensor sensitivity and power consumption are all enough for practical tactile sensor systems.
KW - Integrated MEMS
KW - Interrupt network
KW - Sensor network
KW - Serial communication
KW - Tactile sensor
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U2 - 10.1541/ieejsmas.131.302
DO - 10.1541/ieejsmas.131.302
M3 - Article
AN - SCOPUS:80054970544
VL - 131
SP - 302
EP - 309
JO - IEEJ Transactions on Sensors and Micromachines
JF - IEEJ Transactions on Sensors and Micromachines
SN - 1341-8939
IS - 8
ER -