TY - GEN
T1 - Development of an Application Programming Interface for a Multi-Sensing System Based on Sensor Platform LSIs
AU - Muroyama, Masanori
AU - Tanaka, Shuji
N1 - Funding Information:
ACKNOWLEDGMENT This work was supported by the project of “Development of the Key Technologies for the Next-Generation Artificial Intelligence/Robots” organized by New Energy and Industrial Technology Development Organization (NEDO). This work was also supported by JST COI Grant Number JPMJCE1303.
Publisher Copyright:
© 2021 IEEE.
PY - 2021/5/20
Y1 - 2021/5/20
N2 - We have developed a multi-sensor system by using own multi-sensor platform LSI for versatile applications including next generation robots. For a unified system implementation, the LSI provides the followings: several principle sensor readout circuits, 8-single or 4-differential multi-channels for multi-axis sensing, outputs as a haptic driver controller, flexible system parameter configuration, a RS485 compatible differential signal serial bus communication method, and event-driven response. The LSI can realize wide variety of sensing principle sensor fusion and many sensor installation. So far, we developed 2.5mmX2.5mm size MEMS (Micro Electro Mechanical Systems)-LSI integrated 3-axis force and temperature sensing devices and a 100 device connected tactile sensor network system. However, the system was complex and it took a long time for the development. For reducing the development time and increasing system reliability, we developed an application programming interface (API) for the system. The API consists of documents and basic sensor instruction sets such as system start/stop, sensor configuration setup, capacitive type sensing, analog type sensing, temperature sensing, and digital output. By using this API, we could make high performance multi-sensor systems easily without considering detailed system structures which include sensor platform LSI based sensor nodes, FPGA based relay nodes, and a host software.
AB - We have developed a multi-sensor system by using own multi-sensor platform LSI for versatile applications including next generation robots. For a unified system implementation, the LSI provides the followings: several principle sensor readout circuits, 8-single or 4-differential multi-channels for multi-axis sensing, outputs as a haptic driver controller, flexible system parameter configuration, a RS485 compatible differential signal serial bus communication method, and event-driven response. The LSI can realize wide variety of sensing principle sensor fusion and many sensor installation. So far, we developed 2.5mmX2.5mm size MEMS (Micro Electro Mechanical Systems)-LSI integrated 3-axis force and temperature sensing devices and a 100 device connected tactile sensor network system. However, the system was complex and it took a long time for the development. For reducing the development time and increasing system reliability, we developed an application programming interface (API) for the system. The API consists of documents and basic sensor instruction sets such as system start/stop, sensor configuration setup, capacitive type sensing, analog type sensing, temperature sensing, and digital output. By using this API, we could make high performance multi-sensor systems easily without considering detailed system structures which include sensor platform LSI based sensor nodes, FPGA based relay nodes, and a host software.
KW - API
KW - MEMS-LSI Integrated Device
KW - Multi-Sensing
KW - Sensor Platform LSI
KW - Tactile Sensor Network System
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U2 - 10.1109/ICBIR52339.2021.9465853
DO - 10.1109/ICBIR52339.2021.9465853
M3 - Conference contribution
AN - SCOPUS:85113900570
T3 - 6th International Conference on Business and Industrial Research, ICBIR 2021 - Proceedings
SP - 109
EP - 112
BT - 6th International Conference on Business and Industrial Research, ICBIR 2021 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 6th International Conference on Business and Industrial Research, ICBIR 2021
Y2 - 20 May 2021 through 21 May 2021
ER -