Development of a three-dimensional integrated image sensor with pixel-parallel signal processing architecture

Kei Hagiwara; Masahide Goto; Yuki Honda; Masakazu Nanba; Hiroshi Ohtake; Yoshinori Iguchi; Takuya Saraya; Masaharu Kobayashi; Hiroshi Toshiyoshi; Eiji Higurashi; Toshiro Hiramoto

doi:10.1109/ICSENS.2015.7370672

Development of a three-dimensional integrated image sensor with pixel-parallel signal processing architecture

Kei Hagiwara, Masahide Goto, Yuki Honda, Masakazu Nanba, Hiroshi Ohtake, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Hiroshi Toshiyoshi, Eiji Higurashi, Toshiro Hiramoto

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A prototype sensor was built to demonstrate a 3D integrated CMOS image sensor that incorporates pixel-parallel signal processing architecture. FDSOI substrates with photodiodes and in-pixel ADC circuits were directly bonded after surface activation by plasma treatment. X, Y and θ alignment errors of 20 bonded samples were reduced to within ±0.7 μm, ±0.4 μm, and ±0.004°, respectively by using IR camera system. The resulting sensor successfully captured video images, thus demonstrating the feasibility of 3D integration technology and pixel-parallel architecture for future CMOS image sensors.

Original language	English
Title of host publication	2015 IEEE SENSORS - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781479982028
DOIs	https://doi.org/10.1109/ICSENS.2015.7370672
Publication status	Published - 2015 Dec 31
Externally published	Yes
Event	14th IEEE SENSORS - Busan, Korea, Republic of Duration: 2015 Nov 1 → 2015 Nov 4

Publication series

Name	2015 IEEE SENSORS - Proceedings

Other

Other	14th IEEE SENSORS
Country/Territory	Korea, Republic of
City	Busan
Period	15/11/1 → 15/11/4

Keywords

3D integration technology
CMOS image sensor
wafer bonding

ASJC Scopus subject areas

Instrumentation
Electronic, Optical and Magnetic Materials
Spectroscopy
Electrical and Electronic Engineering

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10.1109/ICSENS.2015.7370672

Cite this

Hagiwara, K., Goto, M., Honda, Y., Nanba, M., Ohtake, H., Iguchi, Y., Saraya, T., Kobayashi, M., Toshiyoshi, H., Higurashi, E., & Hiramoto, T. (2015). Development of a three-dimensional integrated image sensor with pixel-parallel signal processing architecture. In 2015 IEEE SENSORS - Proceedings [7370672] (2015 IEEE SENSORS - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSENS.2015.7370672

Development of a three-dimensional integrated image sensor with pixel-parallel signal processing architecture. / Hagiwara, Kei; Goto, Masahide; Honda, Yuki et al.

2015 IEEE SENSORS - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2015. 7370672 (2015 IEEE SENSORS - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Hagiwara, K, Goto, M, Honda, Y, Nanba, M, Ohtake, H, Iguchi, Y, Saraya, T, Kobayashi, M, Toshiyoshi, H, Higurashi, E & Hiramoto, T 2015, Development of a three-dimensional integrated image sensor with pixel-parallel signal processing architecture. in 2015 IEEE SENSORS - Proceedings., 7370672, 2015 IEEE SENSORS - Proceedings, Institute of Electrical and Electronics Engineers Inc., 14th IEEE SENSORS, Busan, Korea, Republic of, 15/11/1. https://doi.org/10.1109/ICSENS.2015.7370672

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abstract = "A prototype sensor was built to demonstrate a 3D integrated CMOS image sensor that incorporates pixel-parallel signal processing architecture. FDSOI substrates with photodiodes and in-pixel ADC circuits were directly bonded after surface activation by plasma treatment. X, Y and θ alignment errors of 20 bonded samples were reduced to within ±0.7 μm, ±0.4 μm, and ±0.004°, respectively by using IR camera system. The resulting sensor successfully captured video images, thus demonstrating the feasibility of 3D integration technology and pixel-parallel architecture for future CMOS image sensors.",

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AU - Iguchi, Yoshinori

AU - Saraya, Takuya

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Development of a three-dimensional integrated image sensor with pixel-parallel signal processing architecture

Abstract

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Keywords

ASJC Scopus subject areas

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