Development of a nondestructive inspection method for detecting open failures of micro bump interconnections in three dimensionally stacked LSI chips

Yuki Sato, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

We have proposed a new nondestructive evaluation method for detecting delamination between a chip and metallic bumps by measuring local surface deformation of the chip. The magnitude of the local surface deformation was analyzed using a three-dimensional finite element analysis. The local deformation of a silicon chip between adjoining two bumps is a strong function of the magnitude of the mismatch of the thermal expansion coefficient between bump material and underfill material. The amplitude of the local deformation due to the delamination of metallic bumps exceeds 200 nm easily, and it sometimes reaches 600 nm when the underfill material was assumed to be epoxy resin. To confirm that such estimated local deformation of a chip thinner than 100 μm appears in actual stacked structures, we applied a confocal scanning blue laser microscope to measure the local deformation. The measured local deformation was about 200 nm when the thickness of a chip was 100 μm, as was predicted by a finite element analysis. Therefore, it is concluded that a nondestructive inspection method for detecting open failures of bump interconnections in three-dimensional stacked structure has been established.

Original languageEnglish
Title of host publication2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Pages473-479
Number of pages7
DOIs
Publication statusPublished - 2007 Dec 1
EventASME Electronic and Photonics Packaging Division - Vancouver, BC, United States
Duration: 2007 Jul 82007 Jul 12

Publication series

Name2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Volume1

Other

OtherASME Electronic and Photonics Packaging Division
CountryUnited States
CityVancouver, BC
Period07/7/807/7/12

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Computer Science Applications
  • Information Systems

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