Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch

Takafumi Fukushima, Eiji Iwata, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We developed a new self-assembled die bonder to produce three-dimensionally integrated circuit (3D IC) using a multichip-to-wafer bonding method in batch. In the self-assembled multichip bonder, large number of known good dies (KGDs) can be simultaneously transferred to an LSI wafer on which hydrophilic bonding areas with liquid droplets are prepared. The many KGD can be aligned to the bonding areas by the liquid surface tension. The average alignment accuracy was found to be approximately 400 nm and the total alignment time was less than 0.1 sec. After liquid evaporation, the many KGDs can be bonded to the bonding areas in the new self-assembled die bonder.

Original languageEnglish
Title of host publication2009 IEEE International Conference on 3D System Integration, 3DIC 2009
DOIs
Publication statusPublished - 2009 Dec 1
Event2009 IEEE International Conference on 3D System Integration, 3DIC 2009 - San Francisco, CA, United States
Duration: 2009 Sep 282009 Sep 30

Publication series

Name2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Other

Other2009 IEEE International Conference on 3D System Integration, 3DIC 2009
Country/TerritoryUnited States
CitySan Francisco, CA
Period09/9/2809/9/30

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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