Development of a Minimal multi-target helicon sputtering tool

Kazunori Takahashi; Taichi Saito; Hiroyuki Kawasaki; Hayato Chiba; Naoyo Yamamoto; Hisashi Mizuguchi; Michihiro Inoue; Shiro Hara

doi:10.1109/ISSM.2018.8651177

Development of a Minimal multi-target helicon sputtering tool

Kazunori Takahashi, Taichi Saito, Hiroyuki Kawasaki, Hayato Chiba, Naoyo Yamamoto, Hisashi Mizuguchi, Michihiro Inoue, Shiro Hara

ENG - Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A Minimal multi-target helicon sputtering tool is developed to deposit a multi-layer metallic film for electrodes and interconnection wires in the Minimal Fab System.

Original language	English
Title of host publication	2018 International Symposium on Semiconductor Manufacturing, ISSM 2018 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781538662687
DOIs	https://doi.org/10.1109/ISSM.2018.8651177
Publication status	Published - 2019 Feb 22
Event	2018 International Symposium on Semiconductor Manufacturing, ISSM 2018 - Tokyo, Japan Duration: 2018 Dec 10 → 2018 Dec 11

Publication series

Name	IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings
Volume	2018-December
ISSN (Print)	1523-553X

Conference

Conference	2018 International Symposium on Semiconductor Manufacturing, ISSM 2018
Country/Territory	Japan
City	Tokyo
Period	18/12/10 → 18/12/11

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Engineering(all)
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

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10.1109/ISSM.2018.8651177

Cite this

Takahashi, K., Saito, T., Kawasaki, H., Chiba, H., Yamamoto, N., Mizuguchi, H., Inoue, M., & Hara, S. (2019). Development of a Minimal multi-target helicon sputtering tool. In 2018 International Symposium on Semiconductor Manufacturing, ISSM 2018 - Proceedings [8651177] (IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings; Vol. 2018-December). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISSM.2018.8651177

Development of a Minimal multi-target helicon sputtering tool. / Takahashi, Kazunori; Saito, Taichi; Kawasaki, Hiroyuki et al.

2018 International Symposium on Semiconductor Manufacturing, ISSM 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8651177 (IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings; Vol. 2018-December).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Takahashi, K, Saito, T, Kawasaki, H, Chiba, H, Yamamoto, N, Mizuguchi, H, Inoue, M & Hara, S 2019, Development of a Minimal multi-target helicon sputtering tool. in 2018 International Symposium on Semiconductor Manufacturing, ISSM 2018 - Proceedings., 8651177, IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings, vol. 2018-December, Institute of Electrical and Electronics Engineers Inc., 2018 International Symposium on Semiconductor Manufacturing, ISSM 2018, Tokyo, Japan, 18/12/10. https://doi.org/10.1109/ISSM.2018.8651177

Takahashi K, Saito T, Kawasaki H, Chiba H, Yamamoto N, Mizuguchi H et al. Development of a Minimal multi-target helicon sputtering tool. In 2018 International Symposium on Semiconductor Manufacturing, ISSM 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2019. 8651177. (IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings). doi: 10.1109/ISSM.2018.8651177

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title = "Development of a Minimal multi-target helicon sputtering tool",

abstract = "A Minimal multi-target helicon sputtering tool is developed to deposit a multi-layer metallic film for electrodes and interconnection wires in the Minimal Fab System.",

author = "Kazunori Takahashi and Taichi Saito and Hiroyuki Kawasaki and Hayato Chiba and Naoyo Yamamoto and Hisashi Mizuguchi and Michihiro Inoue and Shiro Hara",

year = "2019",

month = feb,

day = "22",

doi = "10.1109/ISSM.2018.8651177",

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series = "IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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AU - Takahashi, Kazunori

AU - Saito, Taichi

AU - Kawasaki, Hiroyuki

AU - Chiba, Hayato

AU - Yamamoto, Naoyo

AU - Mizuguchi, Hisashi

AU - Inoue, Michihiro

AU - Hara, Shiro

PY - 2019/2/22

Y1 - 2019/2/22

N2 - A Minimal multi-target helicon sputtering tool is developed to deposit a multi-layer metallic film for electrodes and interconnection wires in the Minimal Fab System.

AB - A Minimal multi-target helicon sputtering tool is developed to deposit a multi-layer metallic film for electrodes and interconnection wires in the Minimal Fab System.

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U2 - 10.1109/ISSM.2018.8651177

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M3 - Conference contribution

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T3 - IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings

BT - 2018 International Symposium on Semiconductor Manufacturing, ISSM 2018 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2018 International Symposium on Semiconductor Manufacturing, ISSM 2018

Y2 - 10 December 2018 through 11 December 2018

ER -

Development of a Minimal multi-target helicon sputtering tool

Abstract

Publication series

Conference

ASJC Scopus subject areas

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