Development of a high efficiency PFC abatement system utilizing plasma and Ca(OH)2/CaO under a decompression atmosphere

K. Suzuki, Y. Ishihara, K. Sakoda, Yasuyuki Shirai, Masaki Hirayama, Akinobu Teramoto, T. Ohmi, T. Watanabe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

We have developed a PFC abatement system utilizing a 2MHz ICP plasma source and two columns filled with Ca(OH)2/CaO under a decompression atmosphere without fluorine acid drainage treatment. The 2MHz ICP plasma decomposes the PFCs. The Ca(OH)2/CaO columns immobilize the reactive fluorinated compounds. When we treated the emissions from a Si oxidation film etching process chamber by using this abatement system, F2 equivalent removal efficiency and CO2 equivalent removal efficiency were 99.64% and 90.59%, respectively. The discrepancy between the two efficiencies can be attributed to the fact that 98% of CO2 equivalent emissions were caused by power consumption.

Original languageEnglish
Title of host publication2007 International Symposium on Semiconductor Manufacturing, ISSM - Conference Proceedings
Pages171-174
Number of pages4
DOIs
Publication statusPublished - 2007 Dec 1
Event16th Annual 2007 International Symposium on Semiconductor Manufacturing, ISSM - Santa Clara, CA, United States
Duration: 2007 Oct 152007 Oct 17

Publication series

NameIEEE International Symposium on Semiconductor Manufacturing Conference Proceedings
ISSN (Print)1523-553X

Other

Other16th Annual 2007 International Symposium on Semiconductor Manufacturing, ISSM
CountryUnited States
CitySanta Clara, CA
Period07/10/1507/10/17

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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    Suzuki, K., Ishihara, Y., Sakoda, K., Shirai, Y., Hirayama, M., Teramoto, A., Ohmi, T., & Watanabe, T. (2007). Development of a high efficiency PFC abatement system utilizing plasma and Ca(OH)2/CaO under a decompression atmosphere. In 2007 International Symposium on Semiconductor Manufacturing, ISSM - Conference Proceedings (pp. 171-174). [4446796] (IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings). https://doi.org/10.1109/ISSM.2007.4446796