TY - GEN
T1 - Development of 3D-stacked reconfigurable spin logic chip using via-last backside-via 3D integration technology
AU - Tanaka, T.
AU - Kino, H.
AU - Kiyoyama, K.
AU - Ohno, H.
AU - Koyanagi, M.
PY - 2013/11/4
Y1 - 2013/11/4
N2 - A novel 3D-stacked reconfigurable spin logic chip has been successfully developed to overcome drawbacks of conventional reconfigurable LSIs. Two reconfigurable spin logic chips were carefully designed and successfully stacked using via-last backside-via technology. The fastest write speed of 5 ns was obtained in the on-chip SPRAM circuits. In order to achieve higher performance reconfigurable LSIs, parallel reconfiguration was realized with the stacked reconfigurable spin logic chips. Both via-last backside-via 3D integration and ultrafast on-chip SPRAM will bring a new reconfigurable LSI world.
AB - A novel 3D-stacked reconfigurable spin logic chip has been successfully developed to overcome drawbacks of conventional reconfigurable LSIs. Two reconfigurable spin logic chips were carefully designed and successfully stacked using via-last backside-via technology. The fastest write speed of 5 ns was obtained in the on-chip SPRAM circuits. In order to achieve higher performance reconfigurable LSIs, parallel reconfiguration was realized with the stacked reconfigurable spin logic chips. Both via-last backside-via 3D integration and ultrafast on-chip SPRAM will bring a new reconfigurable LSI world.
UR - http://www.scopus.com/inward/record.url?scp=84886662068&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84886662068&partnerID=8YFLogxK
U2 - 10.1109/IITC.2013.6615594
DO - 10.1109/IITC.2013.6615594
M3 - Conference contribution
AN - SCOPUS:84886662068
SN - 9781479904396
T3 - Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013
BT - Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013
T2 - 2013 16th IEEE International Interconnect Technology Conference, IITC 2013
Y2 - 13 June 2013 through 15 June 2013
ER -