TY - GEN
T1 - Development of 3D-IC Embedded Flexible Hybrid System
AU - Lee, Sungho
AU - Susumago, Yuki
AU - Qian, Zhengyang
AU - Takahashi, Noriyuki
AU - Kino, Hisashi
AU - Tanaka, Tetsu
AU - Fukushima, Takafumi
N1 - Funding Information:
ACKNOWLEDGMENT This work was supported by JSPS KAKENHI Grant Number JP18H04159. This research was partially supported by Tateisi Science and Technology Foundation, Research Grant (C) (2187001). This work was performed in the Micro/Nano-machining research and education Center (MNC) and Jun-ichi Nishizawa Research Center at Tohoku University. We would like to acknowledge the Global INTegration Initiative (GINTI) at Tohoku University and Tohoku-Microtec Co., Ltd. for the 3D-IC fabrication.
Publisher Copyright:
© 2019 IEEE.
PY - 2019/10
Y1 - 2019/10
N2 - We have fabricated a new 3D-IC embedded flexible hybrid system (FHS) based on a Fan-Out Wafer-Level Packaging (FOWLP). The unique FHS structure is consisting of PDMS as a flexible substrate in which the 3D-IC with through-Si vias (TSVs) and microbumps are embedded. The mechanical and electrical properties of the 3D-IC embedded FHS are characterized by using repeated bending test with the TSV/microbump daisy chains. The new FHS can be expected to be used as high-performance wearable device systems for biomedical applications.
AB - We have fabricated a new 3D-IC embedded flexible hybrid system (FHS) based on a Fan-Out Wafer-Level Packaging (FOWLP). The unique FHS structure is consisting of PDMS as a flexible substrate in which the 3D-IC with through-Si vias (TSVs) and microbumps are embedded. The mechanical and electrical properties of the 3D-IC embedded FHS are characterized by using repeated bending test with the TSV/microbump daisy chains. The new FHS can be expected to be used as high-performance wearable device systems for biomedical applications.
KW - 3D-IC
KW - Biocompatible
KW - FOWLP
KW - Flexible hybrid electronics (FHE)
KW - Metallization on PDMS
KW - TSV
UR - http://www.scopus.com/inward/record.url?scp=85084115852&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85084115852&partnerID=8YFLogxK
U2 - 10.1109/3DIC48104.2019.9058880
DO - 10.1109/3DIC48104.2019.9058880
M3 - Conference contribution
AN - SCOPUS:85084115852
T3 - IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019
BT - IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 IEEE International 3D Systems Integration Conference, 3DIC 2019
Y2 - 8 October 2019 through 10 October 2019
ER -