Development of 3D-IC Embedded Flexible Hybrid System

Sungho Lee; Yuki Susumago; Zhengyang Qian; Noriyuki Takahashi; Hisashi Kino; Tetsu Tanaka; Takafumi Fukushima

doi:10.1109/3DIC48104.2019.9058880

Development of 3D-IC Embedded Flexible Hybrid System

Sungho Lee, Yuki Susumago, Zhengyang Qian, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We have fabricated a new 3D-IC embedded flexible hybrid system (FHS) based on a Fan-Out Wafer-Level Packaging (FOWLP). The unique FHS structure is consisting of PDMS as a flexible substrate in which the 3D-IC with through-Si vias (TSVs) and microbumps are embedded. The mechanical and electrical properties of the 3D-IC embedded FHS are characterized by using repeated bending test with the TSV/microbump daisy chains. The new FHS can be expected to be used as high-performance wearable device systems for biomedical applications.

Original language	English
Title of host publication	IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781728148700
DOIs	https://doi.org/10.1109/3DIC48104.2019.9058880
Publication status	Published - 2019 Oct
Event	2019 IEEE International 3D Systems Integration Conference, 3DIC 2019 - Sendai, Japan Duration: 2019 Oct 8 → 2019 Oct 10

Publication series

Name	IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019

Conference

Conference	2019 IEEE International 3D Systems Integration Conference, 3DIC 2019
Country	Japan
City	Sendai
Period	19/10/8 → 19/10/10

Keywords

3D-IC
Biocompatible
FOWLP
Flexible hybrid electronics (FHE)
Metallization on PDMS
TSV

ASJC Scopus subject areas

Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/3DIC48104.2019.9058880

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Cite this

Lee, S., Susumago, Y., Qian, Z., Takahashi, N., Kino, H., Tanaka, T., & Fukushima, T. (2019). Development of 3D-IC Embedded Flexible Hybrid System. In IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 [9058880] (IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/3DIC48104.2019.9058880

Development of 3D-IC Embedded Flexible Hybrid System. / Lee, Sungho; Susumago, Yuki; Qian, Zhengyang; Takahashi, Noriyuki; Kino, Hisashi ; Tanaka, Tetsu ; Fukushima, Takafumi.

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. 9058880 (IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Lee, S, Susumago, Y, Qian, Z, Takahashi, N, Kino, H , Tanaka, T & Fukushima, T 2019, Development of 3D-IC Embedded Flexible Hybrid System. in IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019., 9058880, IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019, Institute of Electrical and Electronics Engineers Inc., 2019 IEEE International 3D Systems Integration Conference, 3DIC 2019, Sendai, Japan, 19/10/8. https://doi.org/10.1109/3DIC48104.2019.9058880

Lee S, Susumago Y, Qian Z, Takahashi N, Kino H , Tanaka T et al. Development of 3D-IC Embedded Flexible Hybrid System. In IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019. Institute of Electrical and Electronics Engineers Inc. 2019. 9058880. (IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019). https://doi.org/10.1109/3DIC48104.2019.9058880

Lee, Sungho ; Susumago, Yuki ; Qian, Zhengyang ; Takahashi, Noriyuki ; Kino, Hisashi ; Tanaka, Tetsu ; Fukushima, Takafumi. / Development of 3D-IC Embedded Flexible Hybrid System. IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. (IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019).

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title = "Development of 3D-IC Embedded Flexible Hybrid System",

abstract = "We have fabricated a new 3D-IC embedded flexible hybrid system (FHS) based on a Fan-Out Wafer-Level Packaging (FOWLP). The unique FHS structure is consisting of PDMS as a flexible substrate in which the 3D-IC with through-Si vias (TSVs) and microbumps are embedded. The mechanical and electrical properties of the 3D-IC embedded FHS are characterized by using repeated bending test with the TSV/microbump daisy chains. The new FHS can be expected to be used as high-performance wearable device systems for biomedical applications.",

keywords = "3D-IC, Biocompatible, FOWLP, Flexible hybrid electronics (FHE), Metallization on PDMS, TSV",

author = "Sungho Lee and Yuki Susumago and Zhengyang Qian and Noriyuki Takahashi and Hisashi Kino and Tetsu Tanaka and Takafumi Fukushima",

note = "Funding Information: ACKNOWLEDGMENT This work was supported by JSPS KAKENHI Grant Number JP18H04159. This research was partially supported by Tateisi Science and Technology Foundation, Research Grant (C) (2187001). This work was performed in the Micro/Nano-machining research and education Center (MNC) and Jun-ichi Nishizawa Research Center at Tohoku University. We would like to acknowledge the Global INTegration Initiative (GINTI) at Tohoku University and Tohoku-Microtec Co., Ltd. for the 3D-IC fabrication.; 2019 IEEE International 3D Systems Integration Conference, 3DIC 2019 ; Conference date: 08-10-2019 Through 10-10-2019",

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AU - Tanaka, Tetsu

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N1 - Funding Information: ACKNOWLEDGMENT This work was supported by JSPS KAKENHI Grant Number JP18H04159. This research was partially supported by Tateisi Science and Technology Foundation, Research Grant (C) (2187001). This work was performed in the Micro/Nano-machining research and education Center (MNC) and Jun-ichi Nishizawa Research Center at Tohoku University. We would like to acknowledge the Global INTegration Initiative (GINTI) at Tohoku University and Tohoku-Microtec Co., Ltd. for the 3D-IC fabrication.

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AB - We have fabricated a new 3D-IC embedded flexible hybrid system (FHS) based on a Fan-Out Wafer-Level Packaging (FOWLP). The unique FHS structure is consisting of PDMS as a flexible substrate in which the 3D-IC with through-Si vias (TSVs) and microbumps are embedded. The mechanical and electrical properties of the 3D-IC embedded FHS are characterized by using repeated bending test with the TSV/microbump daisy chains. The new FHS can be expected to be used as high-performance wearable device systems for biomedical applications.

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