Development and characterization of novel metallic joint in power electronic device

Guillaume Lacombe, Jean Marc Heintz, Akira Kawasaki, Jean François Silvain

Research output: Contribution to conferencePaperpeer-review

Abstract

Copper/Carbon composites are now considered as very good candidates to act as efficient heat sinks in power electronics. However, reliability of the whole device still depends on the characteristics of the links between each components of a microelectronic device. This work presents an alternative route to report DBC on a Cu/C heat sink using a thin metallic film deposited by an electrodeposition process.

Original languageEnglish
Publication statusPublished - 2009 Dec 1
Event17th International Conference on Composite Materials, ICCM-17 - Edinburgh, United Kingdom
Duration: 2009 Jul 272009 Jul 31

Other

Other17th International Conference on Composite Materials, ICCM-17
CountryUnited Kingdom
CityEdinburgh
Period09/7/2709/7/31

Keywords

  • CTE
  • Cu/C composite
  • Thermal conductivity
  • Tin electrodeposition

ASJC Scopus subject areas

  • Engineering(all)
  • Ceramics and Composites

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