Abstract
Copper/Carbon composites are now considered as very good candidates to act as efficient heat sinks in power electronics. However, reliability of the whole device still depends on the characteristics of the links between each components of a microelectronic device. This work presents an alternative route to report DBC on a Cu/C heat sink using a thin metallic film deposited by an electrodeposition process.
Original language | English |
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Publication status | Published - 2009 Dec 1 |
Event | 17th International Conference on Composite Materials, ICCM-17 - Edinburgh, United Kingdom Duration: 2009 Jul 27 → 2009 Jul 31 |
Other
Other | 17th International Conference on Composite Materials, ICCM-17 |
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Country/Territory | United Kingdom |
City | Edinburgh |
Period | 09/7/27 → 09/7/31 |
Keywords
- CTE
- Cu/C composite
- Thermal conductivity
- Tin electrodeposition
ASJC Scopus subject areas
- Engineering(all)
- Ceramics and Composites