Development and characterization of novel metallic joint in power electronic device

Guillaume Lacombe; Jean Marc Heintz; Akira Kawasaki; Jean François Silvain

Development and characterization of novel metallic joint in power electronic device

Guillaume Lacombe, Jean Marc Heintz, Akira Kawasaki, Jean François Silvain

ENG - Materials Processing

Research output: Contribution to conference › Paper › peer-review

Abstract

Copper/Carbon composites are now considered as very good candidates to act as efficient heat sinks in power electronics. However, reliability of the whole device still depends on the characteristics of the links between each components of a microelectronic device. This work presents an alternative route to report DBC on a Cu/C heat sink using a thin metallic film deposited by an electrodeposition process.

Original language	English
Publication status	Published - 2009 Dec 1
Event	17th International Conference on Composite Materials, ICCM-17 - Edinburgh, United Kingdom Duration: 2009 Jul 27 → 2009 Jul 31

Other

Other	17th International Conference on Composite Materials, ICCM-17
Country	United Kingdom
City	Edinburgh
Period	09/7/27 → 09/7/31

Keywords

CTE
Cu/C composite
Thermal conductivity
Tin electrodeposition

ASJC Scopus subject areas

Engineering(all)
Ceramics and Composites

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@conference{0d1692d320724b5c8b9138c80615a902,

title = "Development and characterization of novel metallic joint in power electronic device",

abstract = "Copper/Carbon composites are now considered as very good candidates to act as efficient heat sinks in power electronics. However, reliability of the whole device still depends on the characteristics of the links between each components of a microelectronic device. This work presents an alternative route to report DBC on a Cu/C heat sink using a thin metallic film deposited by an electrodeposition process.",

keywords = "CTE, Cu/C composite, Thermal conductivity, Tin electrodeposition",

author = "Guillaume Lacombe and Heintz, {Jean Marc} and Akira Kawasaki and Silvain, {Jean Fran{\c c}ois}",

year = "2009",

month = dec,

day = "1",

language = "English",

note = "17th International Conference on Composite Materials, ICCM-17 ; Conference date: 27-07-2009 Through 31-07-2009",

}

TY - CONF

T1 - Development and characterization of novel metallic joint in power electronic device

AU - Lacombe, Guillaume

AU - Heintz, Jean Marc

AU - Kawasaki, Akira

AU - Silvain, Jean François

PY - 2009/12/1

Y1 - 2009/12/1

N2 - Copper/Carbon composites are now considered as very good candidates to act as efficient heat sinks in power electronics. However, reliability of the whole device still depends on the characteristics of the links between each components of a microelectronic device. This work presents an alternative route to report DBC on a Cu/C heat sink using a thin metallic film deposited by an electrodeposition process.

AB - Copper/Carbon composites are now considered as very good candidates to act as efficient heat sinks in power electronics. However, reliability of the whole device still depends on the characteristics of the links between each components of a microelectronic device. This work presents an alternative route to report DBC on a Cu/C heat sink using a thin metallic film deposited by an electrodeposition process.

KW - CTE

KW - Cu/C composite

KW - Thermal conductivity

KW - Tin electrodeposition

UR - http://www.scopus.com/inward/record.url?scp=80052074149&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=80052074149&partnerID=8YFLogxK

M3 - Paper

T2 - 17th International Conference on Composite Materials, ICCM-17

Y2 - 27 July 2009 through 31 July 2009

ER -