Development and applications of MEMS process tools

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents our recently-developed process tools including atomic layer deposition (ALD) systems for multiple materials, a vacuum wafer bonder, a vacuum flip chip bonder for hermetic chip-scale packaging and a remote-type hot-wire atomic hydrogen source for metal reduction and polymer etching. In addition, examples of micro electro mechanical systems (MEMS) which have been created using the above tools are briefly introduced. The process tools are commercially available with customization, if necessary, via our partner company.

Original languageEnglish
Title of host publication22nd International Display Workshops, IDW 2015
PublisherInternational Display Workshops
Pages1579-1582
Number of pages4
ISBN (Electronic)9781510845503
Publication statusPublished - 2015 Jan 1
Event22nd International Display Workshops, IDW 2015 - Otsu, Japan
Duration: 2015 Dec 92015 Dec 11

Publication series

NameProceedings of the International Display Workshops
Volume3
ISSN (Print)1883-2490

Other

Other22nd International Display Workshops, IDW 2015
CountryJapan
CityOtsu
Period15/12/915/12/11

Keywords

  • Atomic layer deposition (ALD)
  • Flip chip bonder
  • Hot wire reactor
  • Wafer bonder

ASJC Scopus subject areas

  • Computer Vision and Pattern Recognition
  • Human-Computer Interaction
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Radiology Nuclear Medicine and imaging

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