Development and Application of the Stress Sensing Test Chip for IC Plastic Packages

Hideo Miura, Asao Nishimura, Sueo Kawai, Kunihiko Nishi

Research output: Contribution to journalArticlepeer-review

17 Citations (Scopus)

Abstract

A stress sending Si chip utilizing the piezoresistive effect of Si single crystals has been developed. This chip can measure 3-dimensional stress components, σx, σy, σz and shear stress τZM in the chip surface. The stress sensitivity is 0.1 MPa in the range of-100 MPa to 100 MPa. Temperature sensors are arranged in the chip and they have linear response between-100°C and 200°C. This chip is useful for the structural design and reliability tests of IC packages. The residual stress in a chip after the die bonding process is measured using this chip. It is found that rubber paste is useful in reducing stress in that process.

Original languageEnglish
Pages (from-to)1826-1832
Number of pages7
JournalTransactions of the Japan Society of Mechanical Engineers Series A
Volume53
Issue number493
DOIs
Publication statusPublished - 1987
Externally publishedYes

Keywords

  • Experimental Stress Analysis
  • LSI Chip
  • Measurement
  • Piezoresistive Effect IC Plastic Package

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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