Developing process for coating copper particles with silver by electroless plating method

H. T. Hai; J. G. Ahn; D. J. Kim; J. R. Lee; H. S. Chung; C. O. Kim

doi:10.1016/j.surfcoat.2006.03.025

Developing process for coating copper particles with silver by electroless plating method

H. T. Hai, J. G. Ahn, D. J. Kim, J. R. Lee, H. S. Chung, C. O. Kim

ENG - Materials Science

Research output: Contribution to journal › Article › peer-review

65 Citations (Scopus)

Abstract

Silver-copper composite powders were prepared by electroless plating method in aqueous system at room temperature. The dense and uniform silver coating layer was obtained by strictly controlling the activation and deposition process variables such as: NH₄OH/(NH₄)₂SO₄ molar ratio, activation time and feeding rate of silver ion solution. The mechanism of composite powders formation and their characteristics were discussed in detail. It is noted that completely cleansing the oxide layers and protecting the copper particles surface from hydrolysis were key factors to obtain high quality Ag-Cu composite powders.

Original language	English
Pages (from-to)	3788-3792
Number of pages	5
Journal	Surface and Coatings Technology
Volume	201
Issue number	6
DOIs	https://doi.org/10.1016/j.surfcoat.2006.03.025
Publication status	Published - 2006 Dec 4

ASJC Scopus subject areas

Chemistry(all)
Condensed Matter Physics
Surfaces and Interfaces
Surfaces, Coatings and Films
Materials Chemistry

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title = "Developing process for coating copper particles with silver by electroless plating method",

abstract = "Silver-copper composite powders were prepared by electroless plating method in aqueous system at room temperature. The dense and uniform silver coating layer was obtained by strictly controlling the activation and deposition process variables such as: NH4OH/(NH4)2SO4 molar ratio, activation time and feeding rate of silver ion solution. The mechanism of composite powders formation and their characteristics were discussed in detail. It is noted that completely cleansing the oxide layers and protecting the copper particles surface from hydrolysis were key factors to obtain high quality Ag-Cu composite powders.",

author = "Hai, {H. T.} and Ahn, {J. G.} and Kim, {D. J.} and Lee, {J. R.} and Chung, {H. S.} and Kim, {C. O.}",

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language = "English",

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TY - JOUR

T1 - Developing process for coating copper particles with silver by electroless plating method

AU - Hai, H. T.

AU - Ahn, J. G.

AU - Kim, D. J.

AU - Lee, J. R.

AU - Chung, H. S.

AU - Kim, C. O.

PY - 2006/12/4

Y1 - 2006/12/4

N2 - Silver-copper composite powders were prepared by electroless plating method in aqueous system at room temperature. The dense and uniform silver coating layer was obtained by strictly controlling the activation and deposition process variables such as: NH4OH/(NH4)2SO4 molar ratio, activation time and feeding rate of silver ion solution. The mechanism of composite powders formation and their characteristics were discussed in detail. It is noted that completely cleansing the oxide layers and protecting the copper particles surface from hydrolysis were key factors to obtain high quality Ag-Cu composite powders.

AB - Silver-copper composite powders were prepared by electroless plating method in aqueous system at room temperature. The dense and uniform silver coating layer was obtained by strictly controlling the activation and deposition process variables such as: NH4OH/(NH4)2SO4 molar ratio, activation time and feeding rate of silver ion solution. The mechanism of composite powders formation and their characteristics were discussed in detail. It is noted that completely cleansing the oxide layers and protecting the copper particles surface from hydrolysis were key factors to obtain high quality Ag-Cu composite powders.

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U2 - 10.1016/j.surfcoat.2006.03.025

DO - 10.1016/j.surfcoat.2006.03.025

M3 - Article

AN - SCOPUS:33751002342

VL - 201

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EP - 3792

JO - Surface and Coatings Technology

JF - Surface and Coatings Technology

SN - 0257-8972

IS - 6

ER -