Developing process for coating copper particles with silver by electroless plating method

H. T. Hai, J. G. Ahn, D. J. Kim, J. R. Lee, H. S. Chung, C. O. Kim

Research output: Contribution to journalArticlepeer-review

65 Citations (Scopus)

Abstract

Silver-copper composite powders were prepared by electroless plating method in aqueous system at room temperature. The dense and uniform silver coating layer was obtained by strictly controlling the activation and deposition process variables such as: NH4OH/(NH4)2SO4 molar ratio, activation time and feeding rate of silver ion solution. The mechanism of composite powders formation and their characteristics were discussed in detail. It is noted that completely cleansing the oxide layers and protecting the copper particles surface from hydrolysis were key factors to obtain high quality Ag-Cu composite powders.

Original languageEnglish
Pages (from-to)3788-3792
Number of pages5
JournalSurface and Coatings Technology
Volume201
Issue number6
DOIs
Publication statusPublished - 2006 Dec 4

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

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