Determination of elastic-plastic properties of metallic thin wires by small-span bending test

H. Tohmyoh, M. A. Salam Akanda, H. Takeda, M. Saka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A mechanical testing methodology for thin wires based on small-scale bending under lateral load is reported. Geometrical configurations of the wire prepared on a substrate are firstly rearranged for the testing by manipulating it utilizing Joule heating. A small-span bending load is applied at the local area of the wire with two opposite probes, and the small force acting on the loading tip is measured with a capacitance sensor. From the load-displacement relationships obtained by the experiments, Young's modulus and yield strength of the thin wire are successfully determined.

Original languageEnglish
Title of host publication12th International Conference on Fracture 2009, ICF-12
Pages2410-2415
Number of pages6
Publication statusPublished - 2009
Event12th International Conference on Fracture 2009, ICF-12 - Ottawa, ON, Canada
Duration: 2009 Jul 122009 Jul 17

Publication series

Name12th International Conference on Fracture 2009, ICF-12
Volume3

Other

Other12th International Conference on Fracture 2009, ICF-12
Country/TerritoryCanada
CityOttawa, ON
Period09/7/1209/7/17

ASJC Scopus subject areas

  • Geotechnical Engineering and Engineering Geology

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