Design of optically coupled three dimensional common memory for parallel processor system

Mitsumasa Koyanagi; Hirokazu Takata; Hiroki Mori; Masataka Hirose

doi:10.1109/vlsic.1989.1037499

Design of optically coupled three dimensional common memory for parallel processor system

Mitsumasa Koyanagi, Hirokazu Takata, Hiroki Mori, Masataka Hirose

Research output: Contribution to conference › Paper › peer-review

8 Citations (Scopus)

Abstract

The optically coupled three-dimensional common memory (3D-OCC memory) is a newly proposed intelligent memory for high-speed parallel processing in computation. The 3D-OCC memory is able to transfer a large block of data with very high speed by means of optical coupling in the vertical direction; also, stored data in the common memory can be accessed by many processors without collision. The authors describe the design methodology of a 3D-OCC memory with a capacity of 4 kb × 1 b × 4 layers based on 2-μm CMOS technology. This memory has been designed on the basis of the circuit simulation by using the equivalent circuit model for the optical coupling operation.

Original language	English
Pages	81-82
Number of pages	2
DOIs	https://doi.org/10.1109/vlsic.1989.1037499
Publication status	Published - 1989
Externally published	Yes
Event	Symposium on VLSI Circuits 1989 - Kyoto, Japan Duration: 1989 May 25 → 1989 May 27

Other

Other	Symposium on VLSI Circuits 1989
City	Kyoto, Japan
Period	89/5/25 → 89/5/27

ASJC Scopus subject areas

Engineering(all)

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10.1109/vlsic.1989.1037499

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abstract = "The optically coupled three-dimensional common memory (3D-OCC memory) is a newly proposed intelligent memory for high-speed parallel processing in computation. The 3D-OCC memory is able to transfer a large block of data with very high speed by means of optical coupling in the vertical direction; also, stored data in the common memory can be accessed by many processors without collision. The authors describe the design methodology of a 3D-OCC memory with a capacity of 4 kb × 1 b × 4 layers based on 2-μm CMOS technology. This memory has been designed on the basis of the circuit simulation by using the equivalent circuit model for the optical coupling operation.",

author = "Mitsumasa Koyanagi and Hirokazu Takata and Hiroki Mori and Masataka Hirose",

year = "1989",

doi = "10.1109/vlsic.1989.1037499",

language = "English",

pages = "81--82",

note = "Symposium on VLSI Circuits 1989 ; Conference date: 25-05-1989 Through 27-05-1989",

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T1 - Design of optically coupled three dimensional common memory for parallel processor system

AU - Koyanagi, Mitsumasa

AU - Takata, Hirokazu

AU - Mori, Hiroki

AU - Hirose, Masataka

PY - 1989

Y1 - 1989

N2 - The optically coupled three-dimensional common memory (3D-OCC memory) is a newly proposed intelligent memory for high-speed parallel processing in computation. The 3D-OCC memory is able to transfer a large block of data with very high speed by means of optical coupling in the vertical direction; also, stored data in the common memory can be accessed by many processors without collision. The authors describe the design methodology of a 3D-OCC memory with a capacity of 4 kb × 1 b × 4 layers based on 2-μm CMOS technology. This memory has been designed on the basis of the circuit simulation by using the equivalent circuit model for the optical coupling operation.

AB - The optically coupled three-dimensional common memory (3D-OCC memory) is a newly proposed intelligent memory for high-speed parallel processing in computation. The 3D-OCC memory is able to transfer a large block of data with very high speed by means of optical coupling in the vertical direction; also, stored data in the common memory can be accessed by many processors without collision. The authors describe the design methodology of a 3D-OCC memory with a capacity of 4 kb × 1 b × 4 layers based on 2-μm CMOS technology. This memory has been designed on the basis of the circuit simulation by using the equivalent circuit model for the optical coupling operation.

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DO - 10.1109/vlsic.1989.1037499

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EP - 82

T2 - Symposium on VLSI Circuits 1989

Y2 - 25 May 1989 through 27 May 1989

ER -

Design of optically coupled three dimensional common memory for parallel processor system

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