The optically coupled three-dimensional common memory (3D-OCC memory) is a newly proposed intelligent memory for high-speed parallel processing in computation. The 3D-OCC memory is able to transfer a large block of data with very high speed by means of optical coupling in the vertical direction; also, stored data in the common memory can be accessed by many processors without collision. The authors describe the design methodology of a 3D-OCC memory with a capacity of 4 kb × 1 b × 4 layers based on 2-μm CMOS technology. This memory has been designed on the basis of the circuit simulation by using the equivalent circuit model for the optical coupling operation.
|Number of pages||2|
|Publication status||Published - 1989|
|Event||Symposium on VLSI Circuits 1989 - Kyoto, Japan|
Duration: 1989 May 25 → 1989 May 27
|Other||Symposium on VLSI Circuits 1989|
|Period||89/5/25 → 89/5/27|
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