Design of micro-soldering materials in electronic packaging using computational thermodynamics

X. J. Liu, S. L. Chen, I. Ohnuma, K. Ishida, Y. A. Chang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A thermodynamic tool, ADAMIS, has been developed for designing alloys for micro-soldering. It combines phase diagram calculation software with a thermodynamic database for Ag, Bi, Cu, In, Sb, Sn, Zn and Pb. The thermodynamic parameters describing Gibbs energies of the different phases in the database have been evaluated by optimizing experimental data for phase equilibria and thermodynamic properties. Using this tool, a user can easily calculate properties such as the liquidus projection, isothermal and vertical sectional diagrams and phase fraction. In addition, the tool provides other related information such as the surface tension, viscosity of the liquid phase and solidification simulation. This tool is expected to play an important role in alloy design of the solders used in the packaging of electronic devices.

Original languageEnglish
Title of host publicationMechanics and Material Engineering for Science and Experiments
EditorsY. Zhou, Y. Ghu, Z. Li, Y. Zhou, Y. Gu, Z. Li
Pages334-337
Number of pages4
Publication statusPublished - 2003 Oct 17
EventProceedings of the International Symposium of Young Scholars on Mechanics and Material Engineering for Science and Experiments - Changsha/Zhangjiajie, China
Duration: 2001 Aug 112001 Aug 16

Other

OtherProceedings of the International Symposium of Young Scholars on Mechanics and Material Engineering for Science and Experiments
CountryChina
CityChangsha/Zhangjiajie
Period01/8/1101/8/16

Keywords

  • Pb-free solders
  • Thermodynamic calculation
  • Thermodynamic database

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanical Engineering

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