TY - JOUR
T1 - Design and performance of a thin, solid layer for high-resolution, dry-contact acoustic imaging
AU - Tohrayoh, Hironori
AU - Saka, Masumi
N1 - Funding Information:
Manuscript received April 3, 2003; accepted December 6, 2003. This work was partly supported by the Ministry of Education, Culture, Sports, Science and Technology of Japan under Grant-in-Aid for JSPS Fellows 07019 and Grant-in-Aid for Specially Promoted Research (COE)(2) 11CE2003 and the Mitutoyo Association for Science and Technology under Grant No. R0204.
PY - 2004/4
Y1 - 2004/4
N2 - Compared to the usual water immersion case, more effective transmission and reception of high-frequency ultrasound through a thin, solid layer are reported. A theoretical model is presented to perform the signal amplification and the signal modulation toward the higher frequency components for getting the high-quality acoustic images without immersing the object to be imaged. Also, the thin, solid layers are designed from the theoretical model, and the transmission of high-frequency ultrasound is carried out through the layer/silicon interfaces with an applied pressure of about 0.1 MPa. The spectral intensity in the frequency range of 20 to 70 MHz remarkably improves compared with water immersion, and the peak frequencies of the spectra modulate the higher than water immersion. Furthermore, the solder joint inspection of a package is performed. The present dry-contact technique achieves the higher spatial resolution and the higher signal-to-noise ratio (SNR) than the usual water immersion technique, and clearly detects the defective joint without getting the package wet.
AB - Compared to the usual water immersion case, more effective transmission and reception of high-frequency ultrasound through a thin, solid layer are reported. A theoretical model is presented to perform the signal amplification and the signal modulation toward the higher frequency components for getting the high-quality acoustic images without immersing the object to be imaged. Also, the thin, solid layers are designed from the theoretical model, and the transmission of high-frequency ultrasound is carried out through the layer/silicon interfaces with an applied pressure of about 0.1 MPa. The spectral intensity in the frequency range of 20 to 70 MHz remarkably improves compared with water immersion, and the peak frequencies of the spectra modulate the higher than water immersion. Furthermore, the solder joint inspection of a package is performed. The present dry-contact technique achieves the higher spatial resolution and the higher signal-to-noise ratio (SNR) than the usual water immersion technique, and clearly detects the defective joint without getting the package wet.
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U2 - 10.1109/TUFFC.2004.1295428
DO - 10.1109/TUFFC.2004.1295428
M3 - Article
C2 - 15139544
AN - SCOPUS:2442476340
VL - 51
SP - 432
EP - 438
JO - Transactions of the IRE Professional Group on Ultrasonic Engineering
JF - Transactions of the IRE Professional Group on Ultrasonic Engineering
SN - 0885-3010
IS - 4
ER -