Abstract
In this study, we designed an S-type micro-spring for a probe card and fabricated it by UV-LlGA/Ni electroforming. The mechanical properties of electroformed Ni exhibits a lower Young's modulus and a much higher tensile strength than those of conventional bulk material. Using a scanning electron microscope, a newly developed testing machine enables in-situ observation of a microspring during and after loading cycles. During repeated cycles, voids developed on the surface of the microspring, resulting in a decreased spring constant. This determines fatigue strength, and the S-N curves indicate superior characteristics.
| Original language | English |
|---|---|
| Pages | 670-673 |
| Number of pages | 4 |
| Publication status | Published - 2003 |
| Event | IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems - Kyoto, Japan Duration: 2003 Jan 19 → 2003 Jan 23 |
Other
| Other | IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems |
|---|---|
| Country/Territory | Japan |
| City | Kyoto |
| Period | 03/1/19 → 03/1/23 |
ASJC Scopus subject areas
- Control and Systems Engineering
- Mechanical Engineering
- Electrical and Electronic Engineering