Design and in-situ mechanical testing system for probe card/UV-LIGA-Ni microspring

Yasunori Saotome; Satoshi Yokote; Takeshi Okamoto; Seichin Kinuta

Design and in-situ mechanical testing system for probe card/UV-LIGA-Ni microspring

Yasunori Saotome, Satoshi Yokote, Takeshi Okamoto, Seichin Kinuta

Institute for Materials Research (IMR)

Research output: Contribution to conference › Paper › peer-review

18 Citations (Scopus)

Abstract

In this study, we designed an S-type micro-spring for a probe card and fabricated it by UV-LlGA/Ni electroforming. The mechanical properties of electroformed Ni exhibits a lower Young's modulus and a much higher tensile strength than those of conventional bulk material. Using a scanning electron microscope, a newly developed testing machine enables in-situ observation of a microspring during and after loading cycles. During repeated cycles, voids developed on the surface of the microspring, resulting in a decreased spring constant. This determines fatigue strength, and the S-N curves indicate superior characteristics.

Original language	English
Pages	670-673
Number of pages	4
Publication status	Published - 2003 Jul 23
Event	IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems - Kyoto, Japan Duration: 2003 Jan 19 → 2003 Jan 23

Other

Other	IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems
Country	Japan
City	Kyoto
Period	03/1/19 → 03/1/23

ASJC Scopus subject areas

Control and Systems Engineering
Mechanical Engineering
Electrical and Electronic Engineering

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title = "Design and in-situ mechanical testing system for probe card/UV-LIGA-Ni microspring",

abstract = "In this study, we designed an S-type micro-spring for a probe card and fabricated it by UV-LlGA/Ni electroforming. The mechanical properties of electroformed Ni exhibits a lower Young's modulus and a much higher tensile strength than those of conventional bulk material. Using a scanning electron microscope, a newly developed testing machine enables in-situ observation of a microspring during and after loading cycles. During repeated cycles, voids developed on the surface of the microspring, resulting in a decreased spring constant. This determines fatigue strength, and the S-N curves indicate superior characteristics.",

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year = "2003",

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note = "IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems ; Conference date: 19-01-2003 Through 23-01-2003",

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TY - CONF

T1 - Design and in-situ mechanical testing system for probe card/UV-LIGA-Ni microspring

AU - Saotome, Yasunori

AU - Yokote, Satoshi

AU - Okamoto, Takeshi

AU - Kinuta, Seichin

PY - 2003/7/23

Y1 - 2003/7/23

N2 - In this study, we designed an S-type micro-spring for a probe card and fabricated it by UV-LlGA/Ni electroforming. The mechanical properties of electroformed Ni exhibits a lower Young's modulus and a much higher tensile strength than those of conventional bulk material. Using a scanning electron microscope, a newly developed testing machine enables in-situ observation of a microspring during and after loading cycles. During repeated cycles, voids developed on the surface of the microspring, resulting in a decreased spring constant. This determines fatigue strength, and the S-N curves indicate superior characteristics.

AB - In this study, we designed an S-type micro-spring for a probe card and fabricated it by UV-LlGA/Ni electroforming. The mechanical properties of electroformed Ni exhibits a lower Young's modulus and a much higher tensile strength than those of conventional bulk material. Using a scanning electron microscope, a newly developed testing machine enables in-situ observation of a microspring during and after loading cycles. During repeated cycles, voids developed on the surface of the microspring, resulting in a decreased spring constant. This determines fatigue strength, and the S-N curves indicate superior characteristics.

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M3 - Paper

AN - SCOPUS:0037817695

SP - 670

EP - 673

T2 - IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems

Y2 - 19 January 2003 through 23 January 2003

ER -