Design and in-situ mechanical testing system for probe card/UV-LIGA-Ni microspring

Yasunori Saotome, Satoshi Yokote, Takeshi Okamoto, Seichin Kinuta

Research output: Contribution to conferencePaperpeer-review

18 Citations (Scopus)

Abstract

In this study, we designed an S-type micro-spring for a probe card and fabricated it by UV-LlGA/Ni electroforming. The mechanical properties of electroformed Ni exhibits a lower Young's modulus and a much higher tensile strength than those of conventional bulk material. Using a scanning electron microscope, a newly developed testing machine enables in-situ observation of a microspring during and after loading cycles. During repeated cycles, voids developed on the surface of the microspring, resulting in a decreased spring constant. This determines fatigue strength, and the S-N curves indicate superior characteristics.

Original languageEnglish
Pages670-673
Number of pages4
Publication statusPublished - 2003
EventIEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems - Kyoto, Japan
Duration: 2003 Jan 192003 Jan 23

Other

OtherIEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems
Country/TerritoryJapan
CityKyoto
Period03/1/1903/1/23

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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