Design and Feasibility Analysis of Microscale Bumped Channel with Supersonic Flow for Electronics Cooling

Yuya Takahashi, Lin Chen, Junnosuke Okajima, Yuka Iga, Atsuki Komiya, Wu Shung Fu, Shigenao Maruyama

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

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Engineering & Materials Science