Design and fabrication of micro RF coil for MRI

Ying Wu; Yong Qing Jiang; Zhao Ying Zhou; Takahito Ono; Masayoshi Esashi

Design and fabrication of micro RF coil for MRI

Ying Wu, Yong Qing Jiang, Zhao Ying Zhou, Takahito Ono, Masayoshi Esashi

Research output: Contribution to journal › Article › peer-review

Abstract

The design and novel fabrication of micro RF receiver coil with high aspect ratio for miniature magnetic resonance imaging (MRI) system is presented. This micro coil is realized using micro-electro-mechanical system (MEMS) technique combining deep reactive ion etching (deep-RIE) process and copper electroplating. The inner diameter of the fabricated coil is 100 μm, the wire thickness is up to 200 μm, the wire width is approximately 30 μm and the aspect ratio is about 6. On-wafer electrical characterization shows the quality factor is about 4 at 100 MHz, which suggests an alternative method to fabricate metal microstructures with a high aspect ratio.

Original language	English
Pages (from-to)	556-559
Number of pages	4
Journal	Bandaoti Guangdian/Semiconductor Optoelectronics
Volume	27
Issue number	5
Publication status	Published - 2006 Oct 1

Keywords

High aspect ratio
Magnetic resonance imaging sensor
Micro RF coil
Micro-electro-mechanical systems

ASJC Scopus subject areas

Electrical and Electronic Engineering
Control and Systems Engineering

Cite this

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title = "Design and fabrication of micro RF coil for MRI",

abstract = "The design and novel fabrication of micro RF receiver coil with high aspect ratio for miniature magnetic resonance imaging (MRI) system is presented. This micro coil is realized using micro-electro-mechanical system (MEMS) technique combining deep reactive ion etching (deep-RIE) process and copper electroplating. The inner diameter of the fabricated coil is 100 μm, the wire thickness is up to 200 μm, the wire width is approximately 30 μm and the aspect ratio is about 6. On-wafer electrical characterization shows the quality factor is about 4 at 100 MHz, which suggests an alternative method to fabricate metal microstructures with a high aspect ratio.",

keywords = "High aspect ratio, Magnetic resonance imaging sensor, Micro RF coil, Micro-electro-mechanical systems",

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year = "2006",

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journal = "Bandaoti Guangdian/Semiconductor Optoelectronics",

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T1 - Design and fabrication of micro RF coil for MRI

AU - Wu, Ying

AU - Jiang, Yong Qing

AU - Zhou, Zhao Ying

AU - Ono, Takahito

AU - Esashi, Masayoshi

PY - 2006/10/1

Y1 - 2006/10/1

N2 - The design and novel fabrication of micro RF receiver coil with high aspect ratio for miniature magnetic resonance imaging (MRI) system is presented. This micro coil is realized using micro-electro-mechanical system (MEMS) technique combining deep reactive ion etching (deep-RIE) process and copper electroplating. The inner diameter of the fabricated coil is 100 μm, the wire thickness is up to 200 μm, the wire width is approximately 30 μm and the aspect ratio is about 6. On-wafer electrical characterization shows the quality factor is about 4 at 100 MHz, which suggests an alternative method to fabricate metal microstructures with a high aspect ratio.

AB - The design and novel fabrication of micro RF receiver coil with high aspect ratio for miniature magnetic resonance imaging (MRI) system is presented. This micro coil is realized using micro-electro-mechanical system (MEMS) technique combining deep reactive ion etching (deep-RIE) process and copper electroplating. The inner diameter of the fabricated coil is 100 μm, the wire thickness is up to 200 μm, the wire width is approximately 30 μm and the aspect ratio is about 6. On-wafer electrical characterization shows the quality factor is about 4 at 100 MHz, which suggests an alternative method to fabricate metal microstructures with a high aspect ratio.

KW - High aspect ratio

KW - Magnetic resonance imaging sensor

KW - Micro RF coil

KW - Micro-electro-mechanical systems

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Design and fabrication of micro RF coil for MRI

Abstract

Keywords

ASJC Scopus subject areas

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