Design and experiment of thermal contact sensor detecting defects on Si wafer surface

Wenjian Lu, Yuki Shimizu, So Ito, Wei Gao

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

A design study of a thermal-type contact sensor for the detection of small defects, the heights of which are less than 16 nm on wafer surfaces, is described in this paper. The feasibility of the contact sensor, which would detect frictional heat generated at the contact with defects, was theoretically investigated focusing on the temperature rise of the sensor element. To investigate the temperature rise of the contact sensor due to the generated frictional heat, both the theoretical calculation with a simple model of heat transfer and a simulation with a finite element model (FEM) were carried out. Relationship between the sensor size and the response of the temperature rise of the contact sensor was also investigated by using FEM simulation.

Original languageEnglish
Title of host publicationEmerging Technology in Precision Engineering XIV
PublisherTrans Tech Publications Ltd
Pages826-831
Number of pages6
ISBN (Print)9783037855096
DOIs
Publication statusPublished - 2012 Jan 1
Event14th International Conference on Precision Engineering, ICPE 2012 - Hyogo, Japan
Duration: 2012 Nov 82012 Nov 10

Publication series

NameKey Engineering Materials
Volume523-524
ISSN (Print)1013-9826
ISSN (Electronic)1662-9795

Other

Other14th International Conference on Precision Engineering, ICPE 2012
CountryJapan
CityHyogo
Period12/11/812/11/10

Keywords

  • Contact sensor
  • FEM
  • Frictional heat
  • Wafer inspection

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Lu, W., Shimizu, Y., Ito, S., & Gao, W. (2012). Design and experiment of thermal contact sensor detecting defects on Si wafer surface. In Emerging Technology in Precision Engineering XIV (pp. 826-831). (Key Engineering Materials; Vol. 523-524). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/KEM.523-524.826