Design and Application of Innovative Multi-table and Bond Head Drive System on Thermal Compression Bonder with UPH over 2000

Kohei Seyama, Shoji Wada, Yuji Eguchi, Tomonori Nakamura, Doug Day, Shigetoshi Sugawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

A new, highly productive and accurate thermal compression bonder is presented. Overcoming the disparity between productivity and accuracy, we propose a multi-table and multi-bond head system utilizing gantries, including: a pipeline system to decrease total cooling time during TCB, a cancellation system for vibration during table motion, and a structure for high force bonding with accuracy appropriate for TCB. On a system containing 2 bond heads on 2 gantries, the total TCB process time applying the proposed pipeline system is decreased to 5.5sec, which is 33% higher productivity compared to series processing. By using a structure of separating the bonder base and moving axis, which functions as a cancellation system for vibration generated from the moving axis, no vibration propagates to the other moving axis, resulting that the system enables high speed operation to improve productivity. Typical systems which mount bonding heads on a gantry are constructed with a cantilever structure having advantages for the structure and light weight while having disadvantages for shifting placement position during high force bonding over 100N. To satisfy both placement accuracy and high force for TCB, a new system is designed which transfers high Z axis force to a separate upper structure, solving the inherent accuracy problems with cantilever systems. At 200N, the placement shifts are 1μm with the system and 12μm without it. By implementing the described functions, a productive and accurate TCB bonder is realized. In this paper, we report detailed experimental results for the functions. The potential of a new TCB bonder including these new functions will be demonstrated through bonding results.

Original languageEnglish
Title of host publicationProceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages392-400
Number of pages9
ISBN (Print)9781538649985
DOIs
Publication statusPublished - 2018 Aug 7
Event68th IEEE Electronic Components and Technology Conference, ECTC 2018 - San Diego, United States
Duration: 2018 May 292018 Jun 1

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2018-May
ISSN (Print)0569-5503

Other

Other68th IEEE Electronic Components and Technology Conference, ECTC 2018
CountryUnited States
CitySan Diego
Period18/5/2918/6/1

Keywords

  • 2.5D
  • Component
  • HBM
  • Productivity
  • TCB
  • TSV

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Seyama, K., Wada, S., Eguchi, Y., Nakamura, T., Day, D., & Sugawa, S. (2018). Design and Application of Innovative Multi-table and Bond Head Drive System on Thermal Compression Bonder with UPH over 2000. In Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018 (pp. 392-400). [8429579] (Proceedings - Electronic Components and Technology Conference; Vol. 2018-May). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2018.00066