TY - GEN
T1 - Design and analysis of high-speed and low power Si interposer for highperformance 3D stacked systems
AU - Otsuka, Kanji
AU - Ri, Kanuku
AU - Koyanagi, Mitsumasa
PY - 2013/12/1
Y1 - 2013/12/1
N2 - For IO interconnection, longer wiring induces larger signal delay and the driving power consumes proportionally the length of wiring. Therefore, high speed and low power IO design is definitely important for how to shorten wiring or to reduce power even relative longer wiring. Si interposer composed multi-chip (2.5D) provides more wiring space, however length of wiring would be longer than 3D-designed chip wiring. Thus, low-power IO system design must be required even in denser configuration. This paper is discussed from fundamental approach for reducing power of IO system.
AB - For IO interconnection, longer wiring induces larger signal delay and the driving power consumes proportionally the length of wiring. Therefore, high speed and low power IO design is definitely important for how to shorten wiring or to reduce power even relative longer wiring. Si interposer composed multi-chip (2.5D) provides more wiring space, however length of wiring would be longer than 3D-designed chip wiring. Thus, low-power IO system design must be required even in denser configuration. This paper is discussed from fundamental approach for reducing power of IO system.
KW - IO circuit
KW - IO for 2.5D-3D
KW - high-speed IO
UR - http://www.scopus.com/inward/record.url?scp=84894213175&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84894213175&partnerID=8YFLogxK
U2 - 10.1109/EDAPS.2013.6724448
DO - 10.1109/EDAPS.2013.6724448
M3 - Conference contribution
AN - SCOPUS:84894213175
SN - 9781479923113
T3 - EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium
SP - 25
EP - 27
BT - EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium
T2 - 2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013
Y2 - 12 December 2013 through 15 December 2013
ER -