Dependence of ecr plasma etching characteristics on sub magnetic field and substrate position

Seiji Samukawa, Sumio Mori, Masami Sasaki

Research output: Contribution to journalArticlepeer-review

25 Citations (Scopus)

Abstract

By using an ECR plasma etching system equipped with a sub magnetic coil, the dependences of etching characteristics on sub magnetic field and substrate position of polyimide film etching are investigated. A bowing-free etching profile, etching rate of more than 1 µm/min, and etching rate uniformity of ±5% on a 6 inches diameter substrate are achieved at the ECR position under O2/SF6 etching gas pressure of 5×10-4 Torr. Etching characteristics at the ECR position are explained by collimated ions, extremely high ion current density and uniform ion current compared with the off-ECR position.

Original languageEnglish
Pages (from-to)792-797
Number of pages6
JournalJapanese journal of applied physics
Volume29
Issue number4 R
DOIs
Publication statusPublished - 1990 Apr
Externally publishedYes

Keywords

  • Anisotropic etching
  • Divergent magnetic field
  • ECR plasma etching
  • ECR position

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

Fingerprint Dive into the research topics of 'Dependence of ecr plasma etching characteristics on sub magnetic field and substrate position'. Together they form a unique fingerprint.

Cite this