Demonstration of inter-chip data transmission in a three-dimensional stacked chip fabricated by chip-level TSV integration

Kazuyuki Hozawa; Futoshi Furuta; Yuko Hanaoka; Mayu Aoki; Kenichi Osada; Kenichi Takeda; Kang Wook Lee; Takafumi Fukushima; Mitsumasa Koyanagi

doi:10.1109/VLSIT.2012.6242518

Demonstration of inter-chip data transmission in a three-dimensional stacked chip fabricated by chip-level TSV integration

Kazuyuki Hozawa, Futoshi Furuta, Yuko Hanaoka, Mayu Aoki, Kenichi Osada, Kenichi Takeda, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

6 Citations (Scopus)

Abstract

Successful 3D integration of a stacked chip fabricated by a "chip-level through-silicon-via (TSV)" process was confirmed by inter-chip data transmission. According to measurements of the electrical properties of the stacked chip, structural design of TSV contact wiring is very important for chip-level/via-last TSV integration. That is, the design influences TSV contact resistance, TSV coupling capacitance, and wiring capacitance of the surrounding Cu/low-k interconnections.

Original language	English
Title of host publication	2012 Symposium on VLSI Technology, VLSIT 2012 - Digest of Technical Papers
Pages	175-176
Number of pages	2
DOIs	https://doi.org/10.1109/VLSIT.2012.6242518
Publication status	Published - 2012
Event	2012 Symposium on VLSI Technology, VLSIT 2012 - Honolulu, HI, United States Duration: 2012 Jun 12 → 2012 Jun 14

Publication series

Name	Digest of Technical Papers - Symposium on VLSI Technology
ISSN (Print)	0743-1562

Other

Other	2012 Symposium on VLSI Technology, VLSIT 2012
Country	United States
City	Honolulu, HI
Period	12/6/12 → 12/6/14

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/VLSIT.2012.6242518

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Cite this

Hozawa, K., Furuta, F., Hanaoka, Y., Aoki, M., Osada, K., Takeda, K., Lee, K. W., Fukushima, T., & Koyanagi, M. (2012). Demonstration of inter-chip data transmission in a three-dimensional stacked chip fabricated by chip-level TSV integration. In 2012 Symposium on VLSI Technology, VLSIT 2012 - Digest of Technical Papers (pp. 175-176). [6242518] (Digest of Technical Papers - Symposium on VLSI Technology). https://doi.org/10.1109/VLSIT.2012.6242518

Demonstration of inter-chip data transmission in a three-dimensional stacked chip fabricated by chip-level TSV integration. / Hozawa, Kazuyuki; Furuta, Futoshi; Hanaoka, Yuko; Aoki, Mayu; Osada, Kenichi; Takeda, Kenichi; Lee, Kang Wook; Fukushima, Takafumi; Koyanagi, Mitsumasa.

2012 Symposium on VLSI Technology, VLSIT 2012 - Digest of Technical Papers. 2012. p. 175-176 6242518 (Digest of Technical Papers - Symposium on VLSI Technology).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Hozawa, K, Furuta, F, Hanaoka, Y, Aoki, M, Osada, K, Takeda, K, Lee, KW, Fukushima, T & Koyanagi, M 2012, Demonstration of inter-chip data transmission in a three-dimensional stacked chip fabricated by chip-level TSV integration. in 2012 Symposium on VLSI Technology, VLSIT 2012 - Digest of Technical Papers., 6242518, Digest of Technical Papers - Symposium on VLSI Technology, pp. 175-176, 2012 Symposium on VLSI Technology, VLSIT 2012, Honolulu, HI, United States, 12/6/12. https://doi.org/10.1109/VLSIT.2012.6242518

Hozawa K, Furuta F, Hanaoka Y, Aoki M, Osada K, Takeda K et al. Demonstration of inter-chip data transmission in a three-dimensional stacked chip fabricated by chip-level TSV integration. In 2012 Symposium on VLSI Technology, VLSIT 2012 - Digest of Technical Papers. 2012. p. 175-176. 6242518. (Digest of Technical Papers - Symposium on VLSI Technology). https://doi.org/10.1109/VLSIT.2012.6242518

Hozawa, Kazuyuki ; Furuta, Futoshi ; Hanaoka, Yuko ; Aoki, Mayu ; Osada, Kenichi ; Takeda, Kenichi ; Lee, Kang Wook ; Fukushima, Takafumi ; Koyanagi, Mitsumasa. / Demonstration of inter-chip data transmission in a three-dimensional stacked chip fabricated by chip-level TSV integration. 2012 Symposium on VLSI Technology, VLSIT 2012 - Digest of Technical Papers. 2012. pp. 175-176 (Digest of Technical Papers - Symposium on VLSI Technology).

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