Degradation of the strength of a grain boundary of Ni-base superalloys under creep-fatigue loading at elevated temperature

Yukako Takahashi, Yifan Luo, Kenta Ishihara, Shujiro Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The degradation of the strength of a grain boundary was measured by using a micro tensile test in a scanning electron microscope. The change of the crystallinity of grain boundaries during creep-fatigue tests of Ni-base alloy such as Alloy 617 and 625 at elevated temperatures was monitored by electron backscatter diffraction analysis. The image quality (IQ) value obtained from the analysis, which indicates the total density of defects, was applied to the quantitative evaluation of the crystallinity. It was clearly observed that the accumulation of defects occurred at grain boundaries which were perpendicular to the loading direction and consisted of grains with large difference of Schmid factor. Bicrystal specimens with different crystallinity were cut from the tested samples and the strength of the bicrystal specimens were measured by using the micro tensile test system. It was confirmed that the strength of a grain boundary decreased monotonically by about 50% with the decrease of IQ value, in other words, the increase in the total density of various defects such as vacancies and dislocations. On the other hand, the effective yielding stress of grains increased monotonically with the decrease of the IQ value. This is because the increase in the total density of these defects suppresses the movement of dislocations, in other words, plastic deformation. Therefore, there were three independent strengths, the strength of two grains and that of a grain boundary which consisted of the bicrystal specimen. Since the strength of grains increased, at the same time, that of a grain boundary decreased monotonically with the decrease of the IQ value, it was confirmed that there was critical IQ value at which the fracture mode of a bicrystal specimen changed from conventional transgranular cracking to intergranular cracking under the application of uniaxial tensile load.

Original languageEnglish
Title of host publicationMechanics of Solids, Structures, and Fluids
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791884607
DOIs
Publication statusPublished - 2020
EventASME 2020 International Mechanical Engineering Congress and Exposition, IMECE 2020 - Virtual, Online
Duration: 2020 Nov 162020 Nov 19

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume12

Conference

ConferenceASME 2020 International Mechanical Engineering Congress and Exposition, IMECE 2020
CityVirtual, Online
Period20/11/1620/11/19

Keywords

  • Bicrystal
  • Creep-fatigue damage
  • EBSD analysis
  • Micro tensile test
  • Ni-base superalloy
  • Strength of a grain boundary

ASJC Scopus subject areas

  • Mechanical Engineering

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