Deep through silicon via in laser-ablated CMOS multi-project wafer for surface-mountable integrated MEMS

Yukio Suzuki, Hideki Hirano, Masanori Muroyama, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationSmart Systems Integration 2019 - International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2019
EditorsThomas Otto
PublisherVDE Verlag GmbH
Pages177-180
Number of pages4
ISBN (Electronic)9783800748785
Publication statusPublished - 2019
Event13th Smart Systems Integration Conference, SSI 2019 - Barcelona, Spain
Duration: 2019 Apr 102019 Apr 11

Publication series

NameSmart Systems Integration 2019 - International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2019

Conference

Conference13th Smart Systems Integration Conference, SSI 2019
CountrySpain
CityBarcelona
Period19/4/1019/4/11

ASJC Scopus subject areas

  • Artificial Intelligence
  • Computer Networks and Communications
  • Computer Science Applications

Cite this