In this paper, we have proposed super chip integration as future novel integration technology. We successfully demonstrated the technique of the deep hole etching on die glued with wafer as a unit process for super chip integration.
|Number of pages||3|
|Publication status||Published - 2004 Dec 1|
|Event||3rd International Conference on Semiconductor Technology, ISTC2004 - Shanghai, China|
Duration: 2004 Sep 15 → 2004 Sep 17
|Other||3rd International Conference on Semiconductor Technology, ISTC2004|
|Period||04/9/15 → 04/9/17|
ASJC Scopus subject areas