Debris-free low-stress laser dicing for multi-layered mems wafers

Masayuki Fujita, Yusaku Izawa, Yosuke Tsurumi, Shuji Tanaka, Hideyuki Fukushi, Keiichi Sueda, Yoshiki Nakata, Noriaki Miyanaga, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We have developed a novel debris-free low-stress laser dicing technology for multi-layered MEMS wafers, which are generally consisted of glass and Si. Our technology combines two processes: dicing guide fabrication and wafer separation process. The first process is the internal transformation using a pulsed 1μm laser. The second process is non-contact separation by thermally-induced crack propagation using a CO2 laser or mechanical separation by bending stress. We tested several pulsed lasers with different pulsewidths, including a Nd:YVO4 laser and an Yb fiber laser for generating the internal transformation in silicon and/or glass. The internal transformed lines worked well as a guide of the separation. We found that the internal transformation only in Si layer was enough for dicing the glass/Si double-layered wafer. Also the thermal stress induced by the CO2 laser was quite effective to propagate the crack inside the glass layer without internal transformation. The double-layered wafer consisting of glass and silicon can be diced in low stress by our technology.

Original languageEnglish
Title of host publicationICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings
PublisherLaser Institute of America
Pages959-962
Number of pages4
ISBN (Print)9780912035598
DOIs
Publication statusPublished - 2009 Jan 1
Event28th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2009 - Orlando, FL, United States
Duration: 2009 Nov 22009 Nov 5

Publication series

NameICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings
Volume102

Other

Other28th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2009
Country/TerritoryUnited States
CityOrlando, FL
Period09/11/209/11/5

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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