Debris-free laser dicing for multi-layered MEMS

Masayuki Fujita, Yusaku Izawa, Yosuke Tsurumi, Shuji Tanaka, Hideyuki Fukushi, Keiichi Sueda, Yoshiki Nakata, Noriaki Miyanaga, Masayoshi Esashi

Research output: Contribution to conferencePaperpeer-review


We have developed a novel debris-free in-air laser dicing technology, which gives more design freedoms in the structure, process and materials of multi-layered MEMS as well as improves yields [1]. Our technology combines two processes: dicing guide fabrication and wafer separation process. The first process is the internal transformation using a fundamental wavelength of a Nd:YVO4 laser or a Nd:YAG laser. The second process is non-contact separation by thermally-induced crack propagation using a CO2 laser or mechanical separation by bending stress. The internal transformation fabricated in the first process worked well as the guide for the separation. The diced lines completely followed the pre-fabricated internal transformation.

Original languageEnglish
Number of pages5
Publication statusPublished - 2008 Dec 1
EventICALEO 2008 - 27th International Congress on Applications of Lasers and Electro-Optics - Temecula, CA, United States
Duration: 2008 Oct 202008 Oct 23


OtherICALEO 2008 - 27th International Congress on Applications of Lasers and Electro-Optics
Country/TerritoryUnited States
CityTemecula, CA

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials


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