Debris-free in-air laser dicing for multi-layer MEMS by perforated internal transformation and thermally-induced crack propagation

Y. Izawa, S. Tanaka, H. Kikuchi, Y. Tsurumi, N. Miyanaga, M. Esashi, M. Fujita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

12 Citations (Scopus)

Abstract

We have developed a novel debris-free in-air laser dicing technology, which gives more design freedoms in the structure, process and materials of MEMS as well as improves yields. Our technology combines two processes: dicing guide fabrication and wafer separation process. The first process is the internal transformation using a fundamental wavelength of a Ti:Sapphire laser or a Nd:YAG laser. The second process is non-contact separation by thermally-induced crack propagation using a CO2 laser or mechanical separation by bending stress. The internal transformation fabricated in the first process worked well as the guide of separation, and the processed wafer was diced with low stress. The diced lines completely followed the internal transformation.

Original languageEnglish
Title of host publicationMEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems
Pages822-827
Number of pages6
DOIs
Publication statusPublished - 2008 Aug 29
Event21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson - Tucson, AZ, United States
Duration: 2008 Jan 132008 Jan 17

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson
CountryUnited States
CityTucson, AZ
Period08/1/1308/1/17

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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