Debris-free high-speed laser-assisted low-stress dicing for multi-layered MEMS

Yusaku Izawa, Yosuke Tsurumi, Shuji Tanaka, Hideyuki Fukushi, Keiichi Sueda, Yoshiki Nakata, Masayoshi Esashi, Noriaki Miyanaga, Masayuki Fujita

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)

Abstract

We have investigated a novel debris-free high speed laser dicing technology for MEMS. The target were a Tempax or Pyrex glass and silicon and their anodically-bonded multi-layered wafers. Our technology combines three processes: dicing guide fabrication, wafer separation process, and a tape expansion. First process was the internal transformation using a nanosecond Nd:YVO 4 laser. The laser pulse width and repetition rate was 11 ns and 20 - 100 kHz. The laser scanning speed was over 100 mm/sec. The second process was a mechanical bending separation. The bending stress for glass and Si wafer separation was 10 and 100 MPa, respectively. At the third step, spaces between chips were opened by the tape expansion. The internal transformation fabricated in the first process worked well as the guide of the separation. The diced lines completely followed the internal transformation.

Original languageEnglish
Pages (from-to)63-68
Number of pages6
JournalIEEJ Transactions on Sensors and Micromachines
Volume129
Issue number3
DOIs
Publication statusPublished - 2009 May 12

Keywords

  • Debris-free
  • Glass
  • Internal transformation
  • Laser dicing
  • MEMS
  • Silicon
  • Water free

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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