An SiO 2 deposition process, etching process, and CMP process were explored for two different organic low k dielectrics: the thermoplastic polymer PQ-600 and the thermosetting polymer SiLK Semiconductor Dielectric. From the results, it was confirmed that SiLK polymer has higher damascene process compatibility. This is because SiLK polymer has higher Tg and chemical resistance characteristics based on its thermosetting structure.
ASJC Scopus subject areas
- Chemical Engineering(all)