Damascene process compatibility of organic low k dielectrics

Yutaka Nomura, Fumihiko Ota, Ki Tae Park, Hiroyuki Kurino, Mitsumasa Koyanagi

Research output: Contribution to journalConference articlepeer-review

1 Citation (Scopus)

Abstract

An SiO 2 deposition process, etching process, and CMP process were explored for two different organic low k dielectrics: the thermoplastic polymer PQ-600 and the thermosetting polymer SiLK Semiconductor Dielectric. From the results, it was confirmed that SiLK polymer has higher damascene process compatibility. This is because SiLK polymer has higher Tg and chemical resistance characteristics based on its thermosetting structure.

Original languageEnglish
Pages (from-to)659-664
Number of pages6
JournalAdvanced Metallization Conference (AMC)
Publication statusPublished - 2000 Dec 1
EventAdvanced Metallization Conference 2000 - San Diego, CA, United States
Duration: 2000 Oct 22000 Oct 4

ASJC Scopus subject areas

  • Chemical Engineering(all)

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