Abstract
An SiO 2 deposition process, etching process, and CMP process were explored for two different organic low k dielectrics: the thermoplastic polymer PQ-600 and the thermosetting polymer SiLK Semiconductor Dielectric. From the results, it was confirmed that SiLK polymer has higher damascene process compatibility. This is because SiLK polymer has higher Tg and chemical resistance characteristics based on its thermosetting structure.
Original language | English |
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Pages (from-to) | 659-664 |
Number of pages | 6 |
Journal | Advanced Metallization Conference (AMC) |
Publication status | Published - 2000 Dec 1 |
Event | Advanced Metallization Conference 2000 - San Diego, CA, United States Duration: 2000 Oct 2 → 2000 Oct 4 |
ASJC Scopus subject areas
- Chemical Engineering(all)