Current status and challenges for unified understanding of bonding mechanism in solid particle deposition process

Yuji Ichikawa, Kentaro Shinoda

Research output: Contribution to journalReview articlepeer-review

Abstract

Cold spray (CS) technology is a "solid-phase particle deposition process without melting"; however, it has been established as an additive manufacturing technology that can be applied beyond the framework of one field of thermal spraying. The scope of application of this technology has expanded to include ceramics and polymers. There are other solid particle deposition processes besides CS, such as aerosol deposition (AD), which differ in the material type, size, impact speed, and temperature of the target particles. We can expect that there is a common intrinsic mechanism through which solid-phase particles are joined and deposited in the solid phase. This review summarizes previous studies on the mechanism of cold-spray deposition and bonding, which can be understood as a mechanochemical phenomenon in part, and it is driven by the deformation of the particles and the resulting change in the chemical state of the particle surface, and stabilization by contact in a short time. When we understand these issues correctly, the optimal mechanical conditions (material size and collision conditions) for joining particles of various materials will be systematically understood, and it will be possible to perform different fabrication processes from thin films to additive manufacturing without melting various materials.

Original languageEnglish
Pages (from-to)691-702
Number of pages12
JournalMaterials Transactions
Volume62
Issue number6
DOIs
Publication statusPublished - 2021

Keywords

  • Adiabatic shear instability
  • Aerosol deposition
  • Brittle-ductile transition
  • Ceramics
  • Cold spray
  • Material jet formation
  • Mechanochemistry
  • Metals
  • Room temperature impact consolidation (RTIC)

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint

Dive into the research topics of 'Current status and challenges for unified understanding of bonding mechanism in solid particle deposition process'. Together they form a unique fingerprint.

Cite this