Current and future three-dimensional LSI integration technology by "chip on chip", "chip on wafer" and "wafer on wafer"

Manabu Bonkohara, Makoto Motoyoshi, Kazutoshi Kamibayashi, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)

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Physics & Astronomy

Engineering & Materials Science

Chemical Compounds