Recently the development of three-dimensional large-scale integration (3D-LSI) has been accelerated and its stage has changed from the research level or limited production level to the investigation level with a perspective on mass production. This paper describes the current and future 3D-LSI technologies including Through Silicon Vias (TSVs) focused on image sensor application. Using the current technologies, the chip size packages (CSPs) for 1.3M, 2M, and 5M pixel CMOS image sensors are successfully fabricated without performance degradation. One of many potential applications for 3D-LSI is the high performance focal plane array image sensors. We propose the high-speed image sensor with 100% optical fill factor by using next generation 3D-LSI technology with micro-bumps and micro-TSVs.