Cu-Ti-C alloy with high strength and high electrical conductivity prepared by two-step ball-milling processes

Fenglin Wang, Yunping Li, Kimio Wakoh, Yuichiro Koizumi, Akihiko Chiba

Research output: Contribution to journalArticlepeer-review

42 Citations (Scopus)

Abstract

This study reports a novel Cu-Ti-C alloy prepared using two-step ball-milling processes. Furthermore, the effects of the addition of both C and Ti to pure copper on the electrical conductivity and strength of the developed alloy were investigated in detail. In particular, the addition of both C and Ti in equal molar amounts to the copper matrix yielded an alloy with high strength without sacrificing the electrical conductivity. The addition of C both decreased the amount of titanium in the alloy matrix in the Cu-Ti alloy and led to the formation of homogeneously distributed nanocarbide precipitates in the matrix, which together contributed to the improved properties of the alloy.

Original languageEnglish
Pages (from-to)70-74
Number of pages5
JournalMaterials and Design
Volume61
DOIs
Publication statusPublished - 2014 Sep

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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