TY - JOUR
T1 - Cu-Ti-C alloy with high strength and high electrical conductivity prepared by two-step ball-milling processes
AU - Wang, Fenglin
AU - Li, Yunping
AU - Wakoh, Kimio
AU - Koizumi, Yuichiro
AU - Chiba, Akihiko
PY - 2014/9
Y1 - 2014/9
N2 - This study reports a novel Cu-Ti-C alloy prepared using two-step ball-milling processes. Furthermore, the effects of the addition of both C and Ti to pure copper on the electrical conductivity and strength of the developed alloy were investigated in detail. In particular, the addition of both C and Ti in equal molar amounts to the copper matrix yielded an alloy with high strength without sacrificing the electrical conductivity. The addition of C both decreased the amount of titanium in the alloy matrix in the Cu-Ti alloy and led to the formation of homogeneously distributed nanocarbide precipitates in the matrix, which together contributed to the improved properties of the alloy.
AB - This study reports a novel Cu-Ti-C alloy prepared using two-step ball-milling processes. Furthermore, the effects of the addition of both C and Ti to pure copper on the electrical conductivity and strength of the developed alloy were investigated in detail. In particular, the addition of both C and Ti in equal molar amounts to the copper matrix yielded an alloy with high strength without sacrificing the electrical conductivity. The addition of C both decreased the amount of titanium in the alloy matrix in the Cu-Ti alloy and led to the formation of homogeneously distributed nanocarbide precipitates in the matrix, which together contributed to the improved properties of the alloy.
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U2 - 10.1016/j.matdes.2014.04.034
DO - 10.1016/j.matdes.2014.04.034
M3 - Article
AN - SCOPUS:84899960038
VL - 61
SP - 70
EP - 74
JO - International Journal of Materials in Engineering Applications
JF - International Journal of Materials in Engineering Applications
SN - 0264-1275
ER -