Cu-based amorphous alloys were found to form in Cu-Al-Ce and Cu-Al-Nd systems by rapid solidification. The composition ranges extend from 5 to 13 at%Al and 7 to 10%Ce or Nd for the amorphous single phase and 2 to 13%Al and 3 to 10%Ce or Nd for the amorphous plus fcc-Cu phases. The Cu-based alloys consisting of an amorphous single phase or amorphous plus fcc phases have good bending ductility and the tensile fracture strength is 990 to 1010 MPa for the amorphous alloys and increases to 1190 to 1210 MPa for the mixed phase alloys. Electrical resistivity at room temperature is in the range of 660 to 790 nΩ·m for the amorphous phase and decreases to 350 to 590 nΩ·m for the mixed structure. The amorphous phase in both the alloy systems crystallizes through two stages of Am→Am+fcc-Cu→Cu+compounds and the onset temperature for crystallization increases from 480 to 526 K with increasing solute content. The formation of the Cu-based amorphous alloys in Cu-Al-Ln (Ln = lanthanide metal) system seems to be independent of the kind of Ln elements and the easy glass-formation at a variety of alloy compositions allows us to expect subsequent development of these new alloys.
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