Cu lateral interconnects formed between 100-mm-thick self-assembled chips on flexible substrates

M. Murugesan, J. C. Bea, T. Fukushima, T. Konno, K. Kiyoyama, W. C. Jeong, H. Kino, A. Noriki, K. W. Lee, T. Tanaka, M. Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)

Fingerprint Dive into the research topics of 'Cu lateral interconnects formed between 100-mm-thick self-assembled chips on flexible substrates'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science