Cu damascene interconnects with an organic low-k fluorocarbon dielectric deposited by microwave excited plasma enhanced CVD

X. Gu, T. Nemoto, Y. Tomita, A. Shirotori, R. Duyos-Mateo, K. Miyatani, A. Saito, Y. Kobayashi, Akinobu Teramoto, S. Kuroki, T. Nozawa, T. Matsuoka, Shigetoshi Sugawa, T. Ohmi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

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