Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications

M. Murugesan; E. Sone; A. Simomura; M. Motoyoshi; M. Sawa; K. Fukuda; Mitsumasa Koyanagi; T. Fukushima

doi:10.1109/3DIC52383.2021.9687604

Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications

M. Murugesan, E. Sone, A. Simomura, M. Motoyoshi, M. Sawa, K. Fukuda, Mitsumasa Koyanagi, T. Fukushima

ENG - Mechanical Systems Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

The effect of an extremely large and relatively ordered Cu grains the yield of Cu-Cu direct bonding was investigated. Our modified electroplating process followed by post processing has resulted into the formation of 10-15 μm large Cu grains before Cu-Cu direct bonding. The microstructural evaluation showed formation relatively (100) oriented Cu-grains. The less hard and strain-suppressed Cu-grains as inferred from respectively, Vickers hardness and tensile test highly facilitates the Cu diffusion across the oriented grains during the Cu-Cu direct/hybrid bonding.

Original language	English
Title of host publication	IEEE International 3D System Integration Conference, 3DIC 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781665417068
DOIs	https://doi.org/10.1109/3DIC52383.2021.9687604
Publication status	Published - 2021
Event	2021 IEEE International 3D System Integration Conference, 3DIC 2021 - Virtual, Raleigh, United States Duration: 2021 Nov 15 → 2021 Nov 18

Publication series

Name	IEEE International 3D System Integration Conference, 3DIC 2021

Conference

Conference	2021 IEEE International 3D System Integration Conference, 3DIC 2021
Country/Territory	United States
City	Virtual, Raleigh
Period	21/11/15 → 21/11/18

Keywords

(100) oriented Cu-grain
Cu-Cu direct bonding

ASJC Scopus subject areas

Fluid Flow and Transfer Processes
Hardware and Architecture
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/3DIC52383.2021.9687604

Cite this

Murugesan, M., Sone, E., Simomura, A., Motoyoshi, M., Sawa, M., Fukuda, K., Koyanagi, M., & Fukushima, T. (2021). Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications. In IEEE International 3D System Integration Conference, 3DIC 2021 (IEEE International 3D System Integration Conference, 3DIC 2021). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/3DIC52383.2021.9687604

Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications. / Murugesan, M.; Sone, E.; Simomura, A. et al.

IEEE International 3D System Integration Conference, 3DIC 2021. Institute of Electrical and Electronics Engineers Inc., 2021. (IEEE International 3D System Integration Conference, 3DIC 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Murugesan, M, Sone, E, Simomura, A, Motoyoshi, M, Sawa, M, Fukuda, K, Koyanagi, M & Fukushima, T 2021, Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications. in IEEE International 3D System Integration Conference, 3DIC 2021. IEEE International 3D System Integration Conference, 3DIC 2021, Institute of Electrical and Electronics Engineers Inc., 2021 IEEE International 3D System Integration Conference, 3DIC 2021, Virtual, Raleigh, United States, 21/11/15. https://doi.org/10.1109/3DIC52383.2021.9687604

Murugesan M, Sone E, Simomura A, Motoyoshi M, Sawa M, Fukuda K et al. Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications. In IEEE International 3D System Integration Conference, 3DIC 2021. Institute of Electrical and Electronics Engineers Inc. 2021. (IEEE International 3D System Integration Conference, 3DIC 2021). doi: 10.1109/3DIC52383.2021.9687604

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title = "Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications",

abstract = "The effect of an extremely large and relatively ordered Cu grains the yield of Cu-Cu direct bonding was investigated. Our modified electroplating process followed by post processing has resulted into the formation of 10-15 μm large Cu grains before Cu-Cu direct bonding. The microstructural evaluation showed formation relatively (100) oriented Cu-grains. The less hard and strain-suppressed Cu-grains as inferred from respectively, Vickers hardness and tensile test highly facilitates the Cu diffusion across the oriented grains during the Cu-Cu direct/hybrid bonding. ",

keywords = "(100) oriented Cu-grain, Cu-Cu direct bonding",

author = "M. Murugesan and E. Sone and A. Simomura and M. Motoyoshi and M. Sawa and K. Fukuda and Mitsumasa Koyanagi and T. Fukushima",

note = "Funding Information: Authors thank K. Mori of T-Micro for his support in bonding experiments. Part of this work was performed at the Junichi Nishizawa Research Center and Micro/Nano-machining research and education Center (MNC) at Tohoku University, Japan. Publisher Copyright: {\textcopyright} 2021 IEEE.; 2021 IEEE International 3D System Integration Conference, 3DIC 2021 ; Conference date: 15-11-2021 Through 18-11-2021",

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doi = "10.1109/3DIC52383.2021.9687604",

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AU - Murugesan, M.

AU - Sone, E.

AU - Simomura, A.

AU - Motoyoshi, M.

AU - Sawa, M.

AU - Fukuda, K.

AU - Koyanagi, Mitsumasa

AU - Fukushima, T.

N1 - Funding Information: Authors thank K. Mori of T-Micro for his support in bonding experiments. Part of this work was performed at the Junichi Nishizawa Research Center and Micro/Nano-machining research and education Center (MNC) at Tohoku University, Japan. Publisher Copyright: © 2021 IEEE.

PY - 2021

Y1 - 2021

N2 - The effect of an extremely large and relatively ordered Cu grains the yield of Cu-Cu direct bonding was investigated. Our modified electroplating process followed by post processing has resulted into the formation of 10-15 μm large Cu grains before Cu-Cu direct bonding. The microstructural evaluation showed formation relatively (100) oriented Cu-grains. The less hard and strain-suppressed Cu-grains as inferred from respectively, Vickers hardness and tensile test highly facilitates the Cu diffusion across the oriented grains during the Cu-Cu direct/hybrid bonding.

AB - The effect of an extremely large and relatively ordered Cu grains the yield of Cu-Cu direct bonding was investigated. Our modified electroplating process followed by post processing has resulted into the formation of 10-15 μm large Cu grains before Cu-Cu direct bonding. The microstructural evaluation showed formation relatively (100) oriented Cu-grains. The less hard and strain-suppressed Cu-grains as inferred from respectively, Vickers hardness and tensile test highly facilitates the Cu diffusion across the oriented grains during the Cu-Cu direct/hybrid bonding.

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KW - Cu-Cu direct bonding

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T3 - IEEE International 3D System Integration Conference, 3DIC 2021

BT - IEEE International 3D System Integration Conference, 3DIC 2021

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2021 IEEE International 3D System Integration Conference, 3DIC 2021

Y2 - 15 November 2021 through 18 November 2021

ER -

Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications

Abstract

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Keywords

ASJC Scopus subject areas

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