TY - GEN
T1 - CRYSTALLINITY-INDUCED ACCELERATION OF INTERGRANULAR CRACKING IN THIN-FILM INTERCONNECTIONS UNDER HIGH CURRENT DENSITY
AU - Akasaki, Shota
AU - Miura, Hideo
N1 - Publisher Copyright:
Copyright © 2021 by ASME
PY - 2021
Y1 - 2021
N2 - The degradation process of the crystallinity of grain boundaries in thin-film interconnections was visualized by applying EBSD analysis under high current density. The grain boundary diffusion was accelerated by electromigration only along random grain boundaries with low crystallinity. The crystallinity (IQ value obtained from EBSD analysis) of grain boundaries varied drastically depending on manufacturing process such as temperature, gas pressure, substrate material, and so on. The effective activation energy of self-diffusion of component element was dominated by the crystallinity of random grain boundaries. The measured value obtained from the low-crystallinity interconnections was much lower than that obtained from the thermodynamically stable bulk material, and therefore, the lifetime of intergranular cracking decreased to one hundredth in the worst case.
AB - The degradation process of the crystallinity of grain boundaries in thin-film interconnections was visualized by applying EBSD analysis under high current density. The grain boundary diffusion was accelerated by electromigration only along random grain boundaries with low crystallinity. The crystallinity (IQ value obtained from EBSD analysis) of grain boundaries varied drastically depending on manufacturing process such as temperature, gas pressure, substrate material, and so on. The effective activation energy of self-diffusion of component element was dominated by the crystallinity of random grain boundaries. The measured value obtained from the low-crystallinity interconnections was much lower than that obtained from the thermodynamically stable bulk material, and therefore, the lifetime of intergranular cracking decreased to one hundredth in the worst case.
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U2 - 10.1115/IMECE2021-70222
DO - 10.1115/IMECE2021-70222
M3 - Conference contribution
AN - SCOPUS:85124384478
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
BT - Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2021 International Mechanical Engineering Congress and Exposition, IMECE 2021
Y2 - 1 November 2021 through 5 November 2021
ER -